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Characterization of Thermal Resistance Coefficient of High-power LEDs

机译：大功率LED的热阻系数表征

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摘要

Heat at the junction of light-emitting diodes (LED) affects the overall performance of the LED in terms of light output, spectrum, and life. Usually it is difficult to measure junction temperature of a LED directly. There are several techniques for estimating LED junction temperature. One-dimensional heat transfer analysis is one of the most popular methods for estimating the junction temperature. However, this method requires accurate knowledge of the thermal resistance coefficient from the junction to the board or pin. An experimental study was conducted to investigate what factors affected the thermal resistance coefficient from the junction to the board of high-power LED. Results showed that the thermal resistance coefficient changed as a function of ambient temperature, power dissipation at the junction, the amount of heat sink attached to the LED, and the orientation of the LED with the heat sink. This creates a challenge for using one-dimensional heat transfer analysis to estimate junction temperature of LEDs once incorporated into a lighting system. However, it was observed that junction temperature and board temperature maintains a linear relationship if the power dissipation at the junction is held constant.
机译：发光二极管（LED）结处的热量会影响光输出，光谱和寿命方面的LED整体性能。通常很难直接测量LED的结温。有几种估算LED结温的技术。一维热传递分析是估计结温的最流行方法之一。但是，此方法需要准确了解从结到板或引脚的热阻系数。进行了一项实验研究，以研究哪些因素影响了大功率LED从结到板的热阻系数。结果表明，热阻系数随环境温度，结处的功耗，连接到LED的散热器的数量以及LED与散热器的方向而变化。一旦结合到照明系统中，使用一维热传递分析来估计LED的结温，这便带来了挑战。但是，可以观察到，如果结点处的功耗保持恒定，则结点温度和电路板温度将保持线性关系。

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