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首页> 外文会议>Sixth International Conference on Solid State Lighting >Silicone Materials for LED Packaging
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Silicone Materials for LED Packaging

机译：LED封装用有机硅材料

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摘要

Silicone based materials have attracted considerable attention from light emitting diode (LED) manufacturers for use as encapsulants and lenses for many high brightness LED (HB LED) devices. Currently silicones function in two key roles in HB LED devices, (1) as protective lenses and (2) stress relieving encapsulants for wire bond protection. The key attributes of silicones that make them attractive as light path materials for high brightness HB LEDs include their high transparency in the UV-visible region, controlled refractive index (RI), stable thermo-mechanical properties, and tuneable modulus from soft gels to hard resins. This paper will describe recent developments in moldable silicone hard resin materials. Progress on cavity moldable and liquid injection moldable (LIM) silicone compositions for discreet components is described. Also, an example of liquid injection overmolding is presented.
机译：基于硅树脂的材料已被发光二极管（LED）制造商吸引了相当多的注意力，用作许多高亮度LED（HB LED）器件的密封剂和透镜。目前，有机硅在HB LED器件中起着两个关键作用，（1）作为保护透镜，（2）用于引线键合保护的应力消除密封剂。有机硅的关键特性使它们成为高亮度HB LED的光路材料具有吸引力，包括在紫外可见区域具有高透明性，可控折射率（RI），稳定的热机械性能以及可调节的模量，从软凝胶到硬凝胶树脂。本文将描述可模制的有机硅硬质树脂材料的最新发展。描述了用于离散组件的可模腔成型和可液体注射成型（LIM）硅氧烷组合物的进展。另外，提供了液体注射包覆成型的示例。

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