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首页> 外文会议>Smart Structures and Integrated Systems Mar 3-6, 2003 San Diego, California, USA >Manufacturing and testing of active composite panels with embedded piezoelectric sensors and actuators: wires out by molded-in holes
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Manufacturing and testing of active composite panels with embedded piezoelectric sensors and actuators: wires out by molded-in holes

机译：带有嵌入式压电传感器和执行器的有源复合板的制造和测试：通过模制孔进行布线

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This work presents manufacturing and testing of active composite panels (ACPs) with embedded piezoelectric sensors and actuators. The composite material employed here is a plain weave carbon/epoxy prepreg fabric with about 0.33 mm ply thickness. The piezoelectric patches employed here are Continuum Control Corporation, CCC, (recently, Continuum Photonics, Inc) active fiber composite patches with 0.33 mm thickness, i.e., close to the composite ply thickness. Composite cut-out layers are used to fill the space around the embedded piezoelectric patches to minimize the problems associated with ply drops in composites. The piezoelectric patches were embedded inside the composite laminate. High-temperature wires were soldered to the piezoelectric leads, insulated from the carbon substructure by high-temperature materials, and were taken out of the composite laminates employing a molded-in hole technique that reduces the stress concentration as opposed to a drilled hole, and thereby enhancing the performance of the composite structure. The laminated ACPs were co-cured inside an autoclave employing the cure cycle recommended by the composite material supplier. The curie temperature of the embedded piezoelectric patches should be well above the curing temperature of the composite materials as was the case here. The manufactured ACP beams and plates were trimmed and then tested for their functionality. Vibration suppression as well as simultaneous vibration suppression and precision positioning tests, using PID control as well as Hybrid Adaptive Control techniques were successfully conducted on the manufactured ACP beams and their functionality were demonstrated. Recommendations on the use of this embedding technique for ACPs are provided.
机译：这项工作介绍了带有嵌入式压电传感器和执行器的有源复合板（ACP）的制造和测试。这里使用的复合材料是具有约0.33 mm层厚的平纹碳/环氧预浸料织物。这里使用的压电贴片是Continuum Control Corporation，CCC，（最近，Continuum Photonics，Inc）活性纤维复合贴片，其厚度为0.33mm，即接近复合层的厚度。复合材料切除层用于填充嵌入式压电贴片周围的空间，以最大程度地减少与复合材料中的层状液滴相关的问题。压电贴片嵌入复合层压板内部。将高温线焊接到压电引线上，并通过高温材料将其与碳亚结构绝缘，然后采用模内钻孔技术将其从复合层合物中取出，该技术可降低应力集中，而与钻孔相比，从而增强了复合结构的性能。采用复合材料供应商推荐的固化周期，将层压的ACP高压釜内共固化。嵌入式压电贴片的居里温度应远高于复合材料的固化温度（如此处的情况）。修剪制造的ACP梁和板，然后测试其功能。使用PID控制以及混合自适应控制技术成功地对制造的ACP梁进行了抑振，同时抑振和精确定位测试，并演示了其功能。提供了有关将此嵌入技术用于ACP的建议。

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