【24h】

Substrate Biasing in Pulsed DC Reactive Sputtering of Dielectrics

机译:电介质的脉冲直流无功溅射中的衬底偏置

获取原文
获取原文并翻译 | 示例

摘要

DC reactive sputter deposition of dielectrics can be done using dc power pulsed in the range of 5-350 kHz. Although pulsed dc reactive sputtering (PDRS) does not solve the disappearing anode problem, it provides a deposition process without arcing. Pulsing plasma creates unusual conditions at the substrate, and requires a special approach to biasing. In this work, plasma properties, as well as substrate effects under various biasing conditions, were investigated. Deposition of alumina is used as an example of PDRS.
机译:可以使用在5-350 kHz范围内脉冲的直流功率来完成电介质的DC反应溅射沉积。尽管脉冲直流反应溅射(PDRS)不能解决消失的阳极问题,但它可提供无电弧的沉积工艺。脉冲等离子体会在基板上产生异常状况,并且需要特殊的偏压方法。在这项工作中,研究了等离子体性能以及在各种偏压条件下的衬底效应。氧化铝的沉积用作PDRS的示例。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号