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首页> 外文会议>Solid-state sensor and actuator workshop : Technical digest >A MICRO HEAT EXCHANGER WITH INTEGRATED HEATERS AND THERMOMETERS
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A MICRO HEAT EXCHANGER WITH INTEGRATED HEATERS AND THERMOMETERS

机译：集成加热器和温度计的微型换热器

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摘要

Two-phase microchannel flow has the potential to removernlarge heat fluxes from high-performance integrated circuits. Morernresearch must study the behavior of microchannel heatrnexchangers, in particular the impact of small dimensions onrnbubble formation and the critical heat flux. This work developsrnmicrochannel test devices with integrated heaters andrnthermometers for studying single and two-phase convection.rnFabrication techniques include DRIE and silicon-glass anodicrnbonding. DRIE is used to fabricate rectangular microchannelsrnwith a hydraulic diameter less than 100 μm in silicon chips.rnThese devices include integrated semiconductor heaters andrnthermometers and are enabling detailed experiments on singlernand two-phase forced convective heat removal fromrnmicrochannels. The heat exchangers remove 25 W from 2 cm*rnarea with approximately 50 C average chip temperature risernusing 5 mlimin of DI water, which remains in the liquid state.rnWe observe water boiling in microchannels with a hydraulicrndiameter of 55 μm and a resulting transient temperaturernfluctuation in the microchannel system. Future work is leveragingrnand optimizing this experimental structure for imaging bubblernformation and for studying the critical heat flux.
机译：两相微通道流有可能从高性能集成电路中去除较大的热通量。更多的研究必须研究微通道热交换器的行为，特别是小尺寸对气泡形成和临界热通量的影响。这项工作开发了带有集成加热器和温度计的微通道测试设备，用于研究单相和两相对流。制造技术包括DRIE和硅玻璃阳极键合。 DRIE用于在硅芯片中制造水力直径小于100μm的矩形微通道。这些设备包括集成的半导体加热器和温度计，可用于从微通道中进行单相和两相强制对流除热的详细实验。换热器使用5 mlimin的去离子水将2 cm * rnarea中的25 W芯片平均温度升高约50 C，并保持液态.rn我们观察到微通道中水沸腾，水力直径为55μm，由此产生的瞬时温度波动微通道系统。未来的工作是利用和优化这种实验结构，以成像气泡形状并研究临界热通量。

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  • 来源
  • 会议地点 Hilton Head Island SC(US)
  • 作者

    Lian Zhang; Shilajeet S. Banerjee; Jae-Mo Koo; Daniel J. Laser; Mehdi Asheghi; rnKenneth E. Goodson; Juan G. Santiago; Thomas W. Kenny;

  • 作者单位

    Department of Mechanical Engineering, Design Division, Stanford UniversityrnStanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

    Department of Mechanical Engineering, Design Division, Stanford University Stanford, CA 94305;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 TM938.865;
  • 关键词

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