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Avionics systems on a chip for space exploration

机译:航空电子芯片系统用于太空探索

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The advanced miniaturization of all the on-board spacecraft functions into a highly integrated, modular, and reliable architecture is a major enabling technology for future deep-space and Earth orbiting science missions. Avionics miniaturizatio using advanced deep sub-micron semiconductor digital, analog, as well as Micro Electro mechanical Systemsd (MEMS) technologies will revolutionize the way we build future spacecraft systems. So called micro and nano satellites as well as other micro-systems are possible using these advanced technologies. In this paper, wer present an overview of work in progress at the newly established JPL Center for Integrated Space Microsystems (CISM) in the area of Avionics Systems On a Chip Progrma. This long-term research and development program has been established as part of NASA's Advanced Deep SPace Systems Program (a.k.a. X2000), which also has a near-term project-oriented element, as well as an even longer term research component called Revolutionary Computing technologies. This paper will outine the vison, goals and spcope of the SOAC program, as well as its target mission insertion opporttunities. We also describe a technology challenges and research components. The first SOAC prototype has been designed and submitted for fabrication at the MIT/LL 0.25 micron SIlicon On Insulator (SOI) foundry in July 1998. It contains a telecommunications unit, power management jnit, on-chip computer, non-volatile as well as volatile storage, all on a signle chip. The chip will be tested at JPL in the second quarter of 1999.
机译:将所有机载航天器功能高度小型化为高度集成,模块化和可靠的体系结构,是未来的深空和绕地球轨道科学飞行任务的一项主要技术。使用先进的深亚微米半导体数字,模拟以及微机电系统(MEMS)技术的航空电子设备微型化将彻底改变我们建造未来航天器系统的方式。利用这些先进技术,所谓的微型和纳米卫星以及其他微型系统都是可能的。在本文中,我们将概述航空电子系统片上程序领域中新建立的JPL集成空间微系统中心(CISM)正在进行的工作。此长期研究与开发计划是NASA的Advanced Deep SPace Systems计划(又名X2000)的一部分,该计划还包含一个面向项目的近期元素以及一个名为Revolutionary Computing technologies的更长期研究组件。 。本文将介绍SOAC计划的目的,目标和范围,以及其目标任务插入的机会。我们还将描述技术挑战和研究内容。第一个SOAC原型已于1998年7月设计并提交给MIT / LL 0.25微米绝缘子SIlicon铸造厂(SOI)进行制造。它包含一个电信单元,电源管理器,片上计算机,非易失性以及易失性存储,全部在信号芯片上。该芯片将在1999年第二季度在JPL上进行测试。

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