首页> 外文会议>Symposium on CMOS Front - End Materials and Process Technology; 20030422-20030424; San Francisco,CA; US >Atomic Layer Deposition of Hafnium Oxide Thin Films from Tetrakis(dimethylamino)Hafnium (TDMAH) and Ozone
【24h】

Atomic Layer Deposition of Hafnium Oxide Thin Films from Tetrakis(dimethylamino)Hafnium (TDMAH) and Ozone

机译:四(二甲基氨基)H(TDMAH)和臭氧形成氧化Ha薄膜的原子层沉积

获取原文
获取原文并翻译 | 示例

摘要

Hafnium oxide (HfO_2) thin films were synthesized from tetrakis(dimethylamino) hafnium (TDMAH) and ozone (O_3) by atomic layer deposition (ALD) on 200 mm silicon wafers. Gradual saturation was observed for TDMAH exposure pulse. However O_3 showed better saturation behavior for O_3 exposure. Yet, 100% step coverage was achieved for ~100nm trenches with aspect ratio of 35. Temperature dependence of the deposition rate was studied at susceptor temperature from 160℃ to 420℃. The lowest deposition rate was observed at 320℃. Mercury probe measurements indicated the dielectric constant increased from 16 to 20 as susceptor temperature increased from 200℃ to 320℃. Selected comparisons with tetrakis (ethylmethylamino) hafnium (TEMAH) were also made.
机译:通过四(二甲基氨基)ha(TDMAH)和臭氧(O_3)通过原子层沉积(ALD)在200毫米硅晶片上合成氧化(HfO_2)薄膜。观察到TDMAH暴露脉冲逐渐饱和。但是,O_3对于O_3暴露显示出更好的饱和行为。然而,对于长宽比为35的〜100nm沟槽,实现了100%的台阶覆盖率。在基座温度为160℃至420℃的条件下研究了沉积速率的温度依赖性。在320℃观察到最低的沉积速率。汞探针的测量表明,随着基座温度从200℃上升到320℃,介电常数从16增加到20。还选择了与四(乙基甲基氨基)ha(TEMAH)的比较。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号