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首页> 外文会议>Tenth Color Imaging Conference: Color Science and Engineering Systems, Technologies, Applications Nov 12-15, 2002 Scottsdale, Arizona, USA >Material Identification Via Multi-Spectral Imaging and Its Application to Circuit Boards
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Material Identification Via Multi-Spectral Imaging and Its Application to Circuit Boards

机译：通过多光谱成像识别材料及其在电路板上的应用

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摘要

This paper describes a method for identifying object materials on a raw circuit board by means of multi-spectral imaging. First, we develop a spectral camera system for observing tiny objects. Second, an algorithm is proposed for estimating the spectral reflectance functions of object surfaces. We do not use the finite-dimensional linear model, but present a direct method under the narrow band assumption. We distinguish metals and dielectrics based on the difference of reflectance in changing illumination geometries. Third, an algorithm is presented for classifying the objects into several circuit elements by using the estimated spectral-reflectances. Finally, region segmentation results are demonstrated in an experiment using a real circuit board.
机译：本文介绍了一种通过多光谱成像识别原始电路板上的目标材料的方法。首先，我们开发了用于观察微小物体的光谱相机系统。其次，提出了一种估计物体表面光谱反射率函数的算法。我们不使用有限维线性模型，而是在窄带假设下提出一种直接方法。我们根据照明几何形状变化中反射率的差异来区分金属和电介质。第三，提出了一种算法，通过使用估计的光谱反射率将对象分类为几个电路元件。最后，使用真实电路板在实验中演示了区域分割结果。

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