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首页> 外文会议>Tenth Meeting of the Symposium on Polymers for Microelectronics; 20020508-10; >Characterization of Adhesives for Low Temperature Microelectronics and Photonics Packaging
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Characterization of Adhesives for Low Temperature Microelectronics and Photonics Packaging

机译：低温微电子学和光子学包装用胶粘剂的表征

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摘要

Low temperature microelectronics and photonics packages require resilient and highly robust materials. Such materials must be able to withstand extremely low temperatures and severe changes in thermal stresses, while maintaining their mechanical integrity. In particular, polymer adhesives are difficult to come by for low temperature use. This is largely because they do not retain their mechanical properties at low temperatures (down to 77 K), which results in adhesive shrinkage, embrittlement, and a high loss in strength. In this study, we report on the characterization of a room temperature-cure and a UV-cure adhesive suitable for use in low temperature and vacuum environments. Adhesives are bonded to optical fibers in a single-lap shear configuration and subjected to exposure conditions down to 77 K. The effects of low temperature and temperature cycling on adhesive bond strength are determined using uniaxial tensile tests. A qualitative analysis of failure mechanisms is reported utilizing microscopy techniques. Results of tensile tests reveal that ELC 4480 and TRA-BOND 2151 possess high strength at 300 K. The average bond strength of TRA-BOND 2151 is shown to increase by more than 30% upon cryogenic cycling, while the strength of ELC 4480 decreases by more than 20%.
机译：低温微电子和光子封装需要弹性和高度坚固的材料。此类材料必须能够承受极低的温度和热应力的剧烈变化，同时保持其机械完整性。特别地，聚合物粘合剂难以用于低温用途。这在很大程度上是因为它们在低温（低至77 K）下无法保持其机械性能，这导致粘合剂收缩，变脆和强度高损失。在这项研究中，我们报告了适用于低温和真空环境的室温固化和紫外线固化胶粘剂的表征。粘合剂以单圈剪切结构粘合到光纤，并经受低至77 K的暴露条件。低温和温度循环对粘合剂粘合强度的影响使用单轴拉伸试验确定。利用显微镜技术报道了失效机理的定性分析。拉伸测试结果表明，ELC 4480和TRA-BOND 2151在300 K时具有很高的强度。在低温循环下，TRA-BOND 2151的平均粘结强度显示增加了30％以上，而ELC 4480的强度则降低了30％。超过20％。

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