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CSI Helsinki: comparing three-dimensional imaging of diagonal cutter toolmarks using confocal microscopy and SWLI

机译:CSI赫尔辛基:使用共聚焦显微镜和SWLI比较对角铣刀工具标记的三维成像

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Cutting tools leave characteristic marks that can connect a set of toolmarks to an individual tool. When the depth resolution of an optical microscope is insufficient, more advanced three-dimensional (3D) imaging methods such as Scanning White Light Interferometry (SWLI) and confocal microscopy are required. We cut ten copper wires (2.1±0.1 mm diameter) maintaining a predefined blade orientation and position using diagonal cutting pliers. Images of the sample surfaces were created using equipment based on optical microscopy, SWLI and confocal microscopy. SWLI and confocal microscopy set-ups can produce consistent high-resolution 3D images that are relevant for forensic toolmark comparison.
机译:切削工具会留下可以将一组工具标记连接到单个工具的特征标记。当光学显微镜的深度分辨率不足时,需要更高级的三维(3D)成像方法,例如扫描白光干涉仪(SWLI)和共聚焦显微镜。我们使用斜口钳剪断了十根铜线(直径2.1±0.1毫米),以保持预定的刀片方向和位置。使用基于光学显微镜,SWLI和共聚焦显微镜的设备创建样品表面的图像。 SWLI和共聚焦显微镜设置可以产生一致的高分辨率3D图像,这些图像与法医工具标记比较相关。

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