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首页> 外文会议>TMS(The Minerals, Metals amp; Materials Society) Annual Meeting; 20050213-17; San Francisco, CA(US) >THE THICKNESS UNIFORMITY OF FILMS DEPOSITED BY MULTI- WORKPIECE RF MAGNETRON SPUTTERING
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THE THICKNESS UNIFORMITY OF FILMS DEPOSITED BY MULTI- WORKPIECE RF MAGNETRON SPUTTERING

机译：多工件射频磁控溅射沉积薄膜的厚度均匀性

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摘要

In this paper, we fabricated a radio frequency (RF) magnetron sputtering system with six workpieces, in which the center of the substrate is not coincident with that of the target. A new formula on the relation between the thickness of the thin film and the parameters, such as rotation speed, revolution speed and the distance from target to substrate, was obtained. Utilizing the formula, the three-dimensional curves of film thickness versus the parameters were drawn. From the curves, the optimum parameters of the system can be easily obtained for preparing uniform films or depositing films. It is found that the maximum relative deviation of film thickness distribution is less than 6% within a diameter of 4 inches when the ratio of the rotation speed to revolution speed is 5.3 and the results show good agreement with experimental data.
机译：在本文中，我们制造了一个具有六个工件的射频（RF）磁控溅射系统，其中衬底的中心与目标的中心不一致。得到了一个新的公式，关于薄膜的厚度与参数之间的关系，例如旋转速度，旋转速度以及从靶到基板的距离。利用该公式，绘制了膜厚与参数的三维曲线。从曲线可以容易地获得系统的最佳参数，以制备均匀的膜或沉积膜。研究发现，当转速与转速之比为5.3时，在4英寸直径范围内，膜厚分布的最大相对偏差小于6％，与实验数据吻合良好。

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