School of Electrical Engineering, Seoul National University, Gwan-ak ro 599, Gwan-ak gu, Seoul 151-744, Korea;
School of Electrical Engineering, Seoul National University, Gwan-ak ro 599, Gwan-ak gu, Seoul 151-744, Korea;
Korea Electronics Technology Institute, 68 Yatap-dong, Bundang-gu, Seongnam, Gyeonggi-do 463-816, Korea;
School of Electrical Engineering, Seoul National University, Gwan-ak ro 599, Gwan-ak gu, Seoul 151-744, Korea;
机译:用不同GaN沟道层厚度对增强型AlGaN / GaN / AlGaN / AlGan双异质结构HEMT的影响
机译:通过AlGaN表面的氧钝化减少AlGaN / GaN HEMT中的栅极泄漏电流
机译:通过退火对AlGaN / GaN HEMT结构中的表面和界面态进行钝化
机译:SiO_2钝化对氧气退火的影响Algan / GaN Hemts
机译:低维硅MOS和AlGaN / GaN HEMT器件中的应变效应。
机译:在SiNx钝化层中注入氟离子的高击穿电压和低动态导通电阻AlGaN / GaN HEMT
机译:N2等离子体预处理对AlGaN / GaN HEMT的SiN钝化的影响