声明
ACKNOWLEDGEMENTS
ABSTRACT
Contents
CHAPTER 1 INTRODUCTION
CHAPTER 2：LITERATURE REVIEW
2．1 WHAt IS SILICON WAFER POLISHING
2．1．1 The polishing process
2．1．2 Polishing slurry
2．1．3 Machines used in polishing of wafers
2．2 TYPES OF PADS
2．3 FACTORS AFFECTING POLISHING
2．3．1 Pores
2．3．2 Pressure and clogging on pad during polishing
2．3．3 Pad stiffness
2．4 FIBRES
2．5 METHODS OF MANUFACTURING POROUS STRUCTURES
2．5．1 Solvent casting method
2．5．2 Electro spinning
2．5．3 Gas foaming
2．5．4 Encapsulation
2．6 NONWWOVEN TECHNIQUES
2．6．1 Needle punching
2．6．2 Thermalbonding in nonwovens
CHAPTER 3 METHODOLOGY
3．1 DESIGNING THE PAD
3．1．1 Fibres used for making the pad
3．2 PRODUCTION AND TREATMENT OF SAMPLES
3．2．1 Production
3．2．2 Treatment of samples
3．3 TESTING
3．3．1 Conditioning
3．3．2 Determination of the density of the pad
3．3．2 Determination of the tensile strength，elongation and elasticity
3．3．3 Analysing the porosity
3．3．4 Pore sizes
3．3．5 DSC tests
3．4 POLISHING MACHINE
CHAPTER 4：RESULTS AND DISCUSSION
4．1 DETERMINING THE EFFECTIVENESS REMOVAL OF PVA
4．1．1 Weight analysis
4．1．2 Effect of temperature on the removal of PVA effect of time on the removal of PVA
4．1．3 Image analysis
4．2 TENSILE STRENGTH
4．2．1 Effect of fabric areal density on tensile strength
4．3 THERMAL BONDING ANALYSIS
4．3．1 DSC tests
4．3．2 Effects of temperature on bonding：Shrinkage
4．3．3 Effect of time on bonding effectiveness(tensile strength)
4．3．4 Effect of temperature on tensile strength
4．3．5 Air permeability
4．3．6 Thermal bonding and the elongation of the samples
4．3．7 Pore size
4．5 PAD SELECTION
4．6 REMOVAL OF PVA FOR THERMALLY BONDED PADS
4．7 POLISHING TEST
CHAPTER 5：GONCLUSION
REFERENCES
东华大学;
