Electronics packaging has evolved significantly over the past half-century from I hard-wired components to metal-plated ceramic substrates to the current era of microelectronics as multi-layered polymeric substrates. The limits of the current technology for multi-chip modules (MCM-D's) are the functionality and processing of the dielectric (polyimide) layer. Methods of improving the production of MCM-D's by using a self-adhesive dielectric film as well as evaluating potentially better alternative polyimide substrates are investigated. The effects of surface modification of the dielectric films by reactive ion etching (RIE) and argon plasma etching are also examined. By balancing material properties, processing conditions, and plasma modification of the polyimide films, smaller and more efficient MCM-D's can be produced.
展开▼
