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首页> 外文学位 >Highly integrated three dimensional millimeter-wave passive front-end architectures using system-on-package (SOP) technologies for broadband telecommunications and multimedia/sensing applications.
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Highly integrated three dimensional millimeter-wave passive front-end architectures using system-on-package (SOP) technologies for broadband telecommunications and multimedia/sensing applications.

机译：使用系统级封装（SOP）技术的高度集成的三维毫米波无源前端体系结构，用于宽带电信和多媒体/传感应用。

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摘要

The objective of the proposed research is to present a compact system-on-package (SOP)-based passive front-end solution for millimeter-wave wireless communication/sensor applications, that consists of fully integrated three dimensional (3D) cavity filters/duplexers and antenna. The presented concept is applied to the design, fabrication and testing of V-band transceiver front-end modules using multilayer low temperature co-fired (LTCC) technology. The millimeter-wave front-end module is the foundation of 60 GHz (V-band) wireless systems for short-range multimedia applications, such as high-speed internet access, video streaming and content download. Its integration poses stringent challenges in terms of high performance, large number of embedded passive components, low power consumption, low interference between integrated components and compactness.; In this work, various compact and high-performance passive building blocks have been developed in both microstrip and cavity configurations and their integration, enabling a complete passives integration solution for 3D low-cost wireless millimeter-wave front-end modules. It is worthy to note that most of the designs implemented comes away with novel ideas and is presented as the first extensive state-of-art components, entirely validated by measured data at 60 GHz bands.
机译：拟议研究的目的是提出一种用于毫米波无线通信/传感器应用的紧凑型基于封装系统（SOP）的无源前端解决方案，该解决方案由完全集成的三维（3D）腔体滤波器/双工器组成和天线。提出的概念适用于使用多层低温共烧（LTCC）技术的V波段收发器前端模块的设计，制造和测试。毫米波前端模块是60 GHz（V波段）无线系统的基础，用于短距离多媒体应用，例如高速Internet访问，视频流和内容下载。它的集成在高性能，嵌入式无源组件数量大，功耗低，集成组件之间的干扰少以及紧凑性方面提出了严峻的挑战。在这项工作中，在微带和腔体配置及其集成方面开发了各种紧凑而高性能的无源构建块，从而为3D低成本无线毫米波前端模块提供了完整的无源集成解决方案。值得一提的是，大多数实施的设计都带有新颖的想法，并作为第一个广泛的，最先进的组件呈现，完全由60 GHz频段的测量数据验证。

著录项

  • 作者

    Lee, Jong-Hoon.;

  • 作者单位

    Georgia Institute of Technology.;

  • 授予单位 Georgia Institute of Technology.;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 2007
  • 页码 203 p.
  • 总页数 203
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;
  • 关键词

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