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Underfill selection methodology for component underfilling process.

机译：底部填充工艺的底部填充选择方法。

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摘要

Modern electronics advance towards complex, high density, high speed, thinner and lighter products for portability. Reliability concerns arise due to the use of BGAs and CSPs in portable electronics. Underfilling the components offers a solution for the reliability concerns, however increases the unit manufacturing cost due to materials, capital equipment and process time. Although underfill often increases the reliability of the package, the use of wrong underfill could be detrimental to the reliability. Therefore, material selection becomes important in spite of high testing costs and time associated with it.A systematic underfill selection approach has been presented in this research work to characterize and identify promising materials for the process. The selection methodology presented in this work aims to cut down the costs in underfill selection through simpler and innovative non assembly tests. The drop and thermal cycling tests on assemblies were also done in this research work to test the relevance of the selection methodology. In addition to the development of the selection methodology, the effect of moisture on the adhesion strength of the underfills was extensively studied with a DOE. Two soldermask surfaces, PR77 and PSR4000, were tested with five different corner &edge bond materials and six capillary underfills after varying degree of exposure to moisture. The adhesion to PR 77 soldermask was greater compared to PSR 4000 soldermask surface and statistically verified. The identification of soldermask as a factor affecting the soldermask is an important addition to the existing literature.
机译：为了便携性，现代电子产品向复杂，高密度，高速，更薄，更轻的产品发展。由于在便携式电子产品中使用了BGA和CSP，因此引起了可靠性问题。填充不足的组件为可靠性问题提供了解决方案，但是由于材料，固定设备和处理时间而增加了单位制造成本。尽管底部填充通常会提高包装的可靠性，但是使用错误的底部填充可能会损害可靠性。因此，尽管有较高的测试成本和时间，但是材料的选择仍然很重要。在这项研究工作中，提出了一种系统的底部填充选择方法，以表征和确定该工艺中有希望的材料。这项工作中介绍的选择方法旨在通过更简单和创新的非组装测试来降低底部填充选择的成本。在这项研究工作中，还对组件进行了跌落和热循环测试，以测试选择方法的相关性。除了开发选择方法外，还使用DOE广泛研究了水分对底部填充胶粘合强度的影响。在不同程度地暴露于湿气之后，使用五种不同的角边接合材料和六种毛细管底部填充材料测试了两个阻焊膜表面PR77和PSR4000。与PSR 4000阻焊层的表面相比，对PR 77阻焊层的附着力更高，并且经过统计验证。将阻焊层识别为影响阻焊层的因素是对现有文献的重要补充。

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  • 作者

    Kesavakumaran, Varun.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Engineering Industrial.Engineering Packaging.
  • 学位 M.S.
  • 年度 2010
  • 页码 148 p.
  • 总页数 148
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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