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Characterization of microfabricated two-phase heat sinks for IC cooling applications.

机译：用于IC冷却应用的微型两相散热器的特性。

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摘要

The increasing heat generation rates in integrated circuit (IC) chips pose severe thermal management challenges for the semiconductor industry. The cooling capacity of conventional heat sinks will soon reach their limit and novel methods for heat dissipation from ICs need to be developed. Two-phase microchannels and microjets have received attention because they promise compact and efficient cooling solutions.; This dissertation focuses on microchannel cooling technologies during incipient boiling, where bubbles nucleate, grow, and depart from nucleation sites on channel walls. Understanding bubble dynamics and determining departure criteria are critical in these devices such that local dry-out and subsequently poor cooling in regions can be avoided. Silicon microchannels with hydraulic diameters less than 400 mum were fabricated with heaters and sensors. When heating power was applied, bubbles formed due to heterogeneous nucleation and grew from the channel side-walls. In order to understand bubble dynamics, micron-resolution particle image velocimetry (muPIV) was used to obtain two-dimensional liquid velocity fields surrounding the nucleating bubbles. However, the limited information from the data requires the development of a hybrid method to reconstruct the three-dimensional geometry and associated three-dimensional velocity field. The combination of experiments and numerical simulations with this methodology yields important information such as bubble geometry, growth rates, contact angles, and forces that contribute towards the understanding of the physical mechanisms behind growth and departure.; Some recent efforts on two-phase microjet impingement cooling are also presented. In this project, microjet test structures were designed, fabricated, and characterized using a custom heater device.{09}A theoretical model developed for single-phase single jet impingement shows good agreement with the data. Heat removal of over 90 W/cm2 using a 4-microjet array was demonstrated, which suggests microjet impingement is a promising cooling solution. Insights into microjet hydrodynamics were also obtained with flow visualizations using white light microscopy and muPIV.; These current studies show promise towards developing optimized MEMS two-phase heat sinks for future IC chip cooling. The heat sinks are intended for the eventual integration into a closed-loop electroosmotically pumped cooling system.
机译：集成电路（IC）芯片中发热量的不断提高给半导体行业提出了严峻的热管理挑战。传统散热器的冷却能力将很快达到极限，因此需要开发用于IC散热的新方法。两相微通道和微喷射器因其提供紧凑而有效的冷却解决方案而受到关注。本文着眼于初期沸腾过程中的微通道冷却技术，其中气泡成核，生长并从通道壁上的成核位置脱离。在这些设备中，了解气泡动力学并确定偏离标准至关重要，这样可以避免局部变干以及随后区域内散热不良。用加热器和传感器制造了水力直径小于400微米的硅微通道。当施加加热功率时，由于异质形核而形成气泡，并且气泡从通道侧壁生长。为了了解气泡动力学，使用了微米级分辨率的粒子图像测速仪（muPIV）来获得围绕成核气泡的二维液体速度场。但是，来自数据的有限信息需要开发一种混合方法来重建三维几何形状和关联的三维速度场。实验和数值模拟与这种方法的结合产生了重要的信息，例如气泡的几何形状，生长速率，接触角和作用力，这些信息有助于理解生长和偏离的物理机制。还介绍了两相微射流冲击冷却的一些最新成果。在此项目中，使用定制的加热器设备设计，制造和表征了微射流测试结构。{09}为单相单射流撞击开发的理论模型与数据显示出良好的一致性。演示了使用4-microjet阵列的热去除效率超过90 W / cm2，这表明microjet撞击是一种很有前途的冷却解决方案。通过使用白光显微镜和muPIV的流动可视化，也获得了对微射流动力学的洞察力。这些最新研究表明，有望为未来的IC芯片冷却开发优化的MEMS两相散热器。散热器用于最终集成到电渗泵闭式冷却系统中。

著录项

  • 作者

    Wang, Evelyn N.;

  • 作者单位

    Stanford University.;

  • 授予单位 Stanford University.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2006
  • 页码 123 p.
  • 总页数 123
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;
  • 关键词

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