• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文学位 >Modeling study of the properties of polymer-particulate composite for the optoelectronic device packaging.
【24h】

Modeling study of the properties of polymer-particulate composite for the optoelectronic device packaging.

机译：用于光电子器件包装的聚合物-颗粒复合材料的性能建模研究。

获取原文
获取原文并翻译 | 示例
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Rapid developments in the wireless and telecom/data-com industries have immensely increased demand for composite materials for the packaging of Radio Frequency (RF), microwave and optical products. However to use composite materials for applications in these industries, properties such as the thermal conductivity, thermal expansion coefficient and the dielectric properties of the composite materials must be precisely quantified. This makes the closed-form formulas of thermal conductivity, thermal expansion coefficient and dielectric constant/loss of composite materials of utmost importance during the design of composite materials using microelectronic and optoelectronic packaging.;During the Integrated Circuit (IC) and optical packaging processes, wire bonding, ribbon bonding, and microstrip lines are utilized to transmit data signal from one component to another. The electrical performance of the transmission structures in packaging designs is very valuable. For example, high speed, low transmission lines are important for a variety of applications such as microwave ICs, ultra fast device characterization and traveling wave optical modulators.;To enhance the mechanical and electrical performance of optical devices a thorough understanding of the interphase between the filler and polymer in composite materials or between the conducting layer and substrate layer is of paramount importance. Therefore for designing and calculating the performance of microelectronic and optical packaging, development of closed forms for Young Modulus, thermal conductivity, expansion coefficient and dielectric constant is essential.;The wireless and telecom/data-com industries rapidly develop that creates high demands for composite materials for the packaging of RF, microwave and optical products. In order to be able to use composite materials having the desired thermal, mechanical, and electrical properties in a given application; the thermal conductivity, the thermal expansion coefficient and the dielectric properties of the composite must be clearly known and fluently understand. Therefore, the closed-form formulas of the thermal conductivity, the thermal expansion and the dielectric constant/loss are very important for design of composite material using in the microelectronic and optoelectronic packaging.;In the IC and optical packaging, the wire bonding, the ribbon bonding and the microstnp line are used to transmit the data signal from one component to another. (Abstract shortened by UMI.)
机译：无线和电信/数据通信行业的快速发展极大地增加了对用于包装射频（RF），微波和光学产品的复合材料的需求。然而，为了将复合材料用于这些行业，必须精确地量化诸如复合材料的导热率，热膨胀系数和介电特性的特性。这使得在使用微电子和光电封装的复合材料设计过程中，复合材料的导热系数，热膨胀系数和介电常数/损耗的闭合形式公式变得至关重要。在集成电路（IC）和光学封装过程中，引线键合，带状键合和微带线用于将数据信号从一个组件传输到另一个组件。包装设计中传动结构的电气性能非常有价值。例如，高速，低传输线对于诸如微波IC，超快器件表征和行波光调制器之类的各种应用非常重要。为了增强光学器件的机械和电气性能，需要透彻了解光路之间的相间。复合材料中或导电层与基材层之间的填充剂和聚合物至关重要。因此，对于设计和计算微电子和光学包装的性能，必须开发封闭的杨氏模量，导热系数，膨胀系数和介电常数的模型。无线和电信/数据通信行业迅速发展，对复合材料提出了很高的要求用于射频，微波和光学产品包装的材料。为了能够在给定应用中使用具有所需热，机械和电性能的复合材料；复合材料的导热系数，热膨胀系数和介电性能必须清楚了解并流利理解。因此，热导率，热膨胀率和介电常数/损耗的闭式公式对于设计用于微电子和光电封装的复合材料非常重要。在IC和光学封装中，引线键合，带键合和microstnp线用于将数据信号从一个组件传输到另一组件。 （摘要由UMI缩短。）

著录项

  • 作者

    Vo, Hung The.;

  • 作者单位

    University of California, Irvine.;

  • 授予单位 University of California, Irvine.;
  • 学科 Engineering Chemical.
  • 学位 Ph.D.
  • 年度 2005
  • 页码 113 p.
  • 总页数 113
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号