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首页> 外文学位 >Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).
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Design, assembly, and reliability evaluation of next generation packaging solution for a System-On-Film (SOF).

机译：薄膜系统（SOF）的下一代包装解决方案的设计，组装和可靠性评估。

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摘要

Rapidly developing field of flexible electronics is driven by increasing demands for higher levels of integration. Flexible circuit technology offers numerous advantages and most important of them are geometrical and mechanical flexibility. One approach, known as chip-on-flex, achieves higher performance and circuit density by mating flexible circuits with surface mount technology components. Industry-wide chip-on-flex packaging solutions that have been used in high volumes are Tape-Carrier-Package (TCP) and Chip-On-Film (COF). The next generation system-level packaging solution being addressed in this research is System-On-Film (SOF) technology. SOF involves the integration of a large die alongside with surface mount passive devices on a flexible substrate. SOFs can be assembled using assembly processes and materials presently used in COF packaging. SOFs offer increased functionality within a single module, which means increased test coverage, and reduced overall costs during integration at the system-level. Due to reduced total cost of ownership and other advantages, SOF technology is being considered as an evolution (advanced version) of COF.;The factors that affect the development of SOF modules are design, assembly processes, handling and operating environment. The primary objective of this research is to investigate the effect of these factors on the mechanical integrity and reliability of the module. The secondary objective is to derive the design guidelines for both manufacturability and usage limitations. The fundamental understanding of the effects of design-process interaction will help in engineering an assembly process for improved module robustness. The effect of handling and operating environment factors on the module reliability are investigated using accelerated stress testing. During this research, it is found that an alternative approach is required for assessing the quality of the bonds formed during the die bonding process. Hence, this research also outlines a methodology to assess the quality of the die bonds.;The complicated task of selecting the appropriate design, process, handling and operating environment can be simplified by developing a system-level investigative approach. The overall solution to the problem is developed considering realistic constraints. Also, this research is able to highlight the complex interactions between different factors affecting the mechanical integrity and reliability of the SOF module.
机译：对更高集成度的需求不断增长，推动了柔性电子领域的快速发展。柔性电路技术具有许多优势，其中最重要的是几何和机械灵活性。一种称为柔性芯片的方法通过将柔性电路与表面贴装技术组件配合使用来实现更高的性能和电路密度。大量使用的行业范围的柔性上芯片封装解决方案是带载封装（TCP）和膜上封装（COF）。这项研究中涉及的下一代系统级包装解决方案是胶片系统（SOF）技术。 SOF涉及将大芯片与表面安装无源器件集成在柔性基板上。可以使用目前在COF包装中使用的组装工艺和材料来组装SOF。 SOF在单个模块中提供了增强的功能，这意味着增加了测试范围，并降低了系统级集成期间的总体成本。由于降低了总体拥有成本和其他优势，SOF技术被认为是COF的演进（高级版本）。影响SOF模块开发的因素包括设计，组装过程，处理和操作环境。这项研究的主要目的是研究这些因素对模块机械完整性和可靠性的影响。第二个目标是针对可制造性和使用限制导出设计指南。对设计过程交互作用的影响的基本理解将有助于设计组装过程，以提高模块的健壮性。使用加速应力测试研究了处理和操作环境因素对模块可靠性的影响。在这项研究中，发现需要一种替代方法来评估在芯片键合过程中形成的键的质量。因此，本研究还概述了评估芯片键合质量的方法。通过开发系统级的调查方法，可以简化选择合适的设计，工艺，处理和操作环境的复杂任务。在考虑实际约束的情况下，开发了该问题的整体解决方案。同样，这项研究能够强调影响SOF模块机械完整性和可靠性的不同因素之间的复杂相互作用。

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  • 作者

    Venkatadri, Vikram.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Engineering Industrial.;Engineering System Science.;Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2012
  • 页码 224 p.
  • 总页数 224
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

  • 入库时间 2022-08-17 11:42:47

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