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首页> 外文学位 >Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages.
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Investigation of hygroscopic swelling behavior of molding compound and its impact on encapsulated MEMS packages.

机译：研究模塑料的吸湿膨胀行为及其对封装的MEMS封装的影响。

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摘要

Many polymer based materials are commonly used in plastic encapsulated packages. In spite of many advantages, most of them, however, are hydrophilic and absorb moisture when exposed to a humid environment. Moisture plays an important role in the integrity and reliability of plastic electronic packages. Recent researches have revealed that the level of hygroscopic stresses is comparable to that of thermo-mechanical stresses and ignoring it may cause a serious consequence in reliability assessment. Moisture will also degrade interfacial adhesion strength so that the interface should become more susceptible to delamination or cracking. Hygro-thermo-mechanical stress and adhesion strength degradation synergistically lead to delamination of interfaces, which eventually results in interconnection failures. Moisture resistance sensitivity tests were introduced as one of the major reliability tests for package qualification. Despite the pivotal role of moisture, research activities in moisture induced failure remain relatively low, compared to the thermally induced failure. This is partly due to the lack of material data and aggravated by the lack of material characterization techniques and procedures, and the near absence of such properties from material vendors.;In this study, the moisture diffusion through material is introduced first. Then, the measurement techniques on the diffusivity and solubility as function of temperatures are described. An innovative measurement method based on Digital Image Correlation (DIC) technique is proposed to measure the coefficient of hygroscopic swelling (CHS) of polymeric materials. The modeling and characterization of hygroscopic swelling are introduced and incorporated into the proposed method. Finally, hygro-thermo-mechanical model for stress-strain analysis is developed and applied to a MEMS package to study the hygro-thermal conjugate effect.
机译：许多聚合物基材料通常用于塑料封装的包装中。尽管有许多优点，但是它们中的大多数具有亲水性，并且在潮湿环境中会吸收水分。水分在塑料电子包装的完整性和可靠性中起着重要作用。最近的研究表明，吸湿应力的水平与热机械应力的水平相当，而忽略它可能会对可靠性评估造成严重后果。水分还会降低界面粘合强度，因此界面应更易于分层或破裂。湿热机械应力和粘合强度降低会协同导致界面分层，最终导致互连失败。引入了防潮敏感性测试，作为包装鉴定的主要可靠性测试之一。尽管水分起着举足轻重的作用，但与热引起的破坏相比，由水分引起的破坏的研究活动仍然相对较低。这部分是由于缺乏材料数据，并且由于缺乏材料表征技术和程序而加剧，并且材料供应商几乎没有这种特性。在本研究中，首先介绍了通过材料的水分扩散。然后，描述了扩散率和溶解度随温度变化的测量技术。提出了一种基于数字图像相关技术（DIC）的创新测量方法，用于测量高分子材料的吸湿膨胀系数（CHS）。介绍了吸湿膨胀的模型和特征，并将其纳入所提出的方法中。最后，开发了用于应力应变分析的湿热力学模型，并将其应用于MEMS封装中以研究湿热共轭效应。

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  • 作者

    Zhang, Haojun.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Engineering Mechanical.
  • 学位 Ph.D.
  • 年度 2011
  • 页码 138 p.
  • 总页数 138
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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