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Assembly and molding processes for three-dimensional microfabrication.

机译：三维微加工的组装和成型过程。

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摘要

Lithographic semiconductor microfabrication has been employed with great success for the manufacture of mechanical structures, achieving microscopic dimensions and great complexity at low cost. However, due to the inherently planar nature of the lithographic process, this technology is limited in its capability to produce three-dimensional structures. In this work, three strategies are presented for extending thin-film microfabrication into the third dimension.; First, the pop-up mechanisms of children's storybooks are utilized on the micro scale to assemble three-dimensional microstructures out of planar parts. Particular attention is given to hinge design in the four-level SUMMiT surface micromachining foundry process. The use of pop-up mechanisms enables more efficient assembly of fold-up MEMS structures and also creates the potential for the parallel assembly of complex three-dimensional microstructures.; Next, a conformal carbon film is produced for use as a release layer in the molding of polysilicon structures. Parylene C polymer is deposited from the vapor phase as a conformal film and then carbonized at 825°C in N2. Pretreatment in a CHF3 and He plasma in addition to a pre-curing step at 490°C are employed to minimize distortion in the carbonization process, during which a one-eighth reduction in thickness occurs. The extremely thin (0.3 μm) and conformal carbon layer yields sub-micron precision in molding. Further, the release process is dry, rapid and extremely selective, allowing large structures to be released without damage. Release is accomplished by oxidizing at 825°C in dry O2 gas, achieving a burnout rate of 50 μm/min for the first 2 mm of undercut.; Finally, parylene structural films are molded and subsequently released without the need for a sacrificial layer or release etch. Application of Micro-90 detergent solution to the mold prior to parylene deposition prevents adhesion. A number of strategies are explored for the aligned bonding of these parylene layers, with thermal-compression showing the most promise. One possible application is a bistable fluid valve for use in an ocular implant for glaucoma therapy. Molded fluid channels and a bistable valve element are demonstrated.
机译：光刻半导体微细加工已成功用于制造机械结构，以低成本实现微观尺寸和极大的复杂性。然而，由于光刻工艺固有的平面性质，该技术在产生三维结构方面的能力受到限制。在这项工作中，提出了三种将薄膜微细加工扩展到三维的策略。首先，儿童故事书的弹出机制在微观尺度上被用来从平面部分组装三维微观结构。在四级SUMMiT表面微加工铸造工艺中，特别要注意铰链设计。弹出机制的使用使折叠式MEMS结构的组装更加有效，也为复杂的三维微结构的并行组装创造了潜力。接下来，生产保形碳膜用作多晶硅结构成型中的脱模层。聚对二甲苯C聚合物从气相中沉积为共形膜，然后在825°C下的N 2 中碳化。除了在490°C下进行预固化步骤外，还应在CHF 3 和He等离子体中进行预处理，以最大程度地减小碳化过程中的变形，在此过程中厚度会减少八分之一。极薄的（0.3μm）保形碳层在成型时可产生亚微米精度。此外，释放过程干燥，快速且具有极高的选择性，可以释放大型结构而不会造成损坏。释放是通过在干燥的O 2 气体中于825°C氧化而实现的，对于底切的前2 mm，燃尽速率为50μm/ min。最后，聚对二甲苯结构膜被模制并且随后被释放，而不需要牺牲层或释放蚀刻。在聚对二甲苯沉积之前，将Micro-90洗涤剂溶液施加到模具上可防止粘附。为了使这些聚对二甲苯层对准排列，人们探索了许多策略，其中热压缩显示出最大的前景。一种可能的应用是用于青光眼治疗的眼用植入物中的双稳态流体阀。演示了模制的流体通道和双稳态阀芯。

著录项

  • 作者

    Hui, Elliot En-Yu.;

  • 作者单位

    University of California, Berkeley.;

  • 授予单位 University of California, Berkeley.;
  • 学科 Engineering Electronics and Electrical.; Engineering Mechanical.; Health Sciences Ophthalmology.
  • 学位 Ph.D.
  • 年度 2002
  • 页码 123 p.
  • 总页数 123
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 无线电电子学、电信技术;机械、仪表工业;
  • 关键词

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