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Testing methodology for reflow soldering process compatibility evaluation of surface mount technology.

机译：用于表面贴装技术的回流焊接工艺兼容性评估的测试方法。

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摘要

Surface Mount Technology (SMT) is one of the most significant developments in the electronics manufacturing industry. The reflow soldering process for surface mount technology is quite different from the traditional wave soldering. A viable testing method for evaluating the SMT reflow soldering process is critically needed, especially now, with the lead-free solder alloys currently being required in the manufacturing industry.;This study proposes a new concept; reflow soldering process compatibility (RSPC), and a test methodology for RSPC evaluation. RSPC is a comprehensive measure of how well the process parameters work together. These parameters include surface finishes, surface conditions, solder alloys, flux types and reflow temperature profiles. Each of these parameters can be controlled in the proposed RSPC test to provide the evaluations of different combinations of test conditions. The purpose of RSPC test is to identify the process combination that is best for a particular set of manufacturing requirements.;RSPC tests are recommended in production, whenever the process parameters need to be changed. These tests can help decide what could be the best combination for the new manufacturing process without stopping and trying different combinations on the production line. This will considerably reduce the cost and time for process changes.;Summary of original contributions to technology. A new concept, reflow soldering process compatibility (RSPC), is introduced this dissertation.;A feasible test methodology for evaluating RSPC, and a quantitative index to measure RSPC called process compatibility index (PCI) are proposed.;PCI is computed by combining two measurable quantities, molten solder spreading coverage and rate. Offset printing technique on the test surface enables the test equipment to monitor the molten solder spreading on the test surface.;The molten solder spreading images are filtered and analyzed sequentially to give the solder spreading coverage and rate, by utilizing the image processing and digital filter algorithms.;The PCI is calculated and reported by the software, and the test procedures are automated by implementing the image processing and digital filter algorithms using C++ and object-oriented design.;The PCI test results for five different surface finishes under different steam age conditions using tin-lead or lead-free solder pastes with no-clean flux are presented in this study. Several hundred of proof-of-principle experiments have been conducted.
机译：表面贴装技术（SMT）是电子制造行业中最重要的发展之一。用于表面贴装技术的回流焊接工艺与传统的波峰焊完全不同。迫切需要一种可行的测试方法来评估SMT回流焊接工艺，尤其是现在，制造业中目前需要无铅焊料合金。回流焊工艺兼容性（RSPC），以及用于RSPC评估的测试方法。 RSPC是过程参数协同工作的全面度量。这些参数包括表面光洁度，表面条件，焊料合金，焊剂类型和回流温度曲线。这些参数中的每一个都可以在建议的RSPC测试中进行控制，以提供对不同测试条件组合的评估。 RSPC测试的目的是确定最适合一组特定制造要求的过程组合。每当需要更改过程参数时，建议在生产中使用RSPC测试。这些测试可以帮助您确定什么是新制造工艺的最佳组合，而无需在生产线上停止并尝试不同的组合。这将大大减少过程更改的成本和时间。；对技术的原始贡献摘要。本文提出了一种新的概念，即回流焊工艺兼容性（RSPC）。；提出了一种可行的评价RSPC的测试方法，并提出了一种用于测量RSPC的定量指标，称为工艺兼容性指数（PCI）。可测量的数量，熔融焊料的扩散范围和速率。测试表面上的胶印技术使测试设备能够监视在测试表面上散布的熔融焊料。通过图像处理和数字滤波器对熔融焊料散布图像进行顺序过滤和分析，以得出焊料散布的覆盖率和速率。通过软件计算和报告PCI，并通过使用C ++和面向对象的设计实现图像处理和数字滤波算法来自动化测试程序。在不同蒸汽年龄下五个不同表面光洁度的PCI测试结果这项研究提出了使用免清洗助焊剂的锡铅或无铅焊膏的条件。已经进行了数百个原理证明实验。

著录项

  • 作者

    Guo, Weiqing.;

  • 作者单位

    The University of Texas at Austin.;

  • 授予单位 The University of Texas at Austin.;
  • 学科 Engineering Electronics and Electrical.;Engineering Industrial.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 236 p.
  • 总页数 236
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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