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首页> 外文学位 >System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques.
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System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques.

机译：使用激光技术进行倒装芯片焊点检查的系统实现，建模和缺陷模式识别。

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摘要

Solder bump technology has been proven to be a reliable interconnection in flip chip and other surface mount components. However, because of the physical configuration of these integrated circuit packages, traditional solder joints inspection methods are either not suitable for solder bump inspection, or not efficient for automated on-line inspection. New techniques for inspecting the solder bump defects in a reliable, fast and non-destructive means are highly desired in today's electronic packaging industry.; The objective of this research is to develop a non-contact, non-destructive, low cost, fast, accurate, high resolution, and automated system for monitoring the quality of solder bumps in flip chips and other surface mount components. This novel approach for solder bump quality inspection has been developed by using laser ultrasonic and interferometric techniques. Experimental results indicate that this system offers great promise for solder bump inspection in a fast and efficient manner. A fully developed system could be used in an assembly line for quality assurance, or off-line during process development for process optimization. A finite element model, based on vibration modal analysis, has been constructed to model the chip vibration phenomenon. The modeling and experimental results indicate that defects in a solder joint change chip's vibration transient response and its natural frequencies. Measurement of these properties can be used to detect solder joint defects. In order to automate this system, a defects pattern recognition method was also developed to automatically classify chips into different clusters, so that good chips can be distinguished from chips with defects. The defects pattern recognition method can find differences between good and bad chips, as well as classifying the type of defect.
机译：焊锡凸点技术已被证明是倒装芯片和其他表面安装元件中的可靠互连。但是，由于这些集成电路封装的物理配置，传统的焊点检查方法要么不适用于焊料凸点检查，要么不适用于自动在线检查。在当今的电子包装行业中，迫切需要一种以可靠，快速且无损的方式检查焊料凸点缺陷的新技术。这项研究的目的是开发一种非接触式，非破坏性，低成本，快速，准确，高分辨率的自动化系统，以监控倒装芯片和其他表面安装组件中的焊料凸点的质量。通过使用激光超声和干涉技术，开发了这种新颖的焊料凸点质量检查方法。实验结果表明，该系统为快速有效地检查焊料凸点提供了广阔的前景。完整开发的系统可以用于流水线以保证质量，也可以在生产过程中脱机以进行过程优化。建立了基于振动模态分析的有限元模型来模拟切屑振动现象。建模和实验结果表明，焊点中的缺陷会改变芯片的振动瞬态响应及其固有频率。这些性能的测量可用于检测焊点缺陷。为了使该系统自动化，还开发了一种缺陷模式识别方法，以将芯片自动分类到不同的簇中，从而可以将优质芯片与有缺陷的芯片区分开。缺陷模式识别方法可以发现好芯片和坏芯片之间的差异，并对缺陷类型进行分类。

著录项

  • 作者

    Liu, Sheng.;

  • 作者单位

    Georgia Institute of Technology, The George W. Woodruff School of Mechanical Engineering.;

  • 授予单位 Georgia Institute of Technology, The George W. Woodruff School of Mechanical Engineering.;
  • 学科 Engineering Mechanical.; Engineering Packaging.
  • 学位 Ph.D.
  • 年度 2001
  • 页码 146 p.
  • 总页数 146
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;包装工程;
  • 关键词

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