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Thin film deposition employing supersonic molecular beams of tunable kinetic energy and angle of incidence.

机译:使用具有可调动能和入射角的超音速分子束进行薄膜沉积。

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Film deposition has been studied using an ultrahigh vacuum reactor that features a supersonic molecular beam. This approach allows for the precise control of precursor kinetic energy and molecular flux. In addition, a beam angle of incidence can be defined due to the high level of collimation. In a study of homoepitaxial deposition of silicon on Si (100), the beam angle of incidence was found to have a dramatic effects on film morphology. An increase in roughness and anisotropic feature formation were observed when beam angles of incidence exceeded 60° from normal. This agrees with recent simulation results as well as various experimental studies. The mechanism used to describe this reactivity-microstructure coupling is shadowing. At fixed angles of incidence, film feature size parallel to the incoming beam is a strong function of substrate temperature. Low energy electron diffraction indicates the deposited film near the surface is well ordered, even at the lowest deposition rates.; Polycrystalline silicon was also deposited using this technique. Polycrystalline material, preferring the 220 columnar arrangement, was observed at substrate temperatures as low as 520°C. Film nucleation was shown to be a strong function of substrate temperature and beam kinetic energy. Furthermore, the nuclei density at fixed temperature suggests that beam kinetic energy can be used to tune grain size. Thin film transistors were fabricated using examples of the deposited films. Both threshold voltage and carrier mobility in these devices were shown to be comparable to material deposited by LPCVD. Building on these results, an atomic hydrogen source was used to Promote selective epitaxial growth. The addition of a continuous hydrogen flux considerably increases polycrystalline film incubation times. Selective epitaxial layers approaching 1000 Å in thickness were demonstrated. In a final study, reactor scale-up strategies were investigated. Polycrystalline silicon films were uniformly deposited on 3 wafers using a supersonic free-jet array. This source geometry was chosen based on a Monte Carlo simulation, whose accuracy was tested by both beam flux and film growth rate measurements. Experimentally, the flux distribution from the source compared well to model predictions.
机译:已经使用具有超音速分子束的超高真空反应器研究了膜沉积。这种方法可以精确控制前驱物的动能和分子通量。此外,由于高准直度,可以定义光束的入射角。在对硅在Si(100)上进行同质外延沉积的研究中,发现光束的入射角对薄膜形态具有显着影响。当光束的入射角与法线超过60°时,会观察到粗糙度和各向异性特征的增加。这与最近的模拟结果以及各种实验研究一致。用于描述这种反应性-微观结构耦合的机制是阴影。在固定的入射角下,平行于入射光束的薄膜特征尺寸是基材温度的重要函数。低能电子衍射表明,即使在最低沉积速率下,在表面附近的沉积膜也是有序的。也使用该技术沉积了多晶硅。在较低的基板温度下观察到多晶材料倾向于采用 220 柱状排列520°C。薄膜成核被证明是衬底温度和束动能的强函数。此外,在固定温度下的核密度表明,束动能可用于调节晶粒尺寸。使用沉积膜的实例来制造薄膜晶体管。这些器件中的阈值电压和载流子迁移率均与LPCVD沉积的材料相当。基于这些结果,原子氢源被用于促进选择性外延生长。添加连续的氢通量会大大增加多晶膜的孵育时间。证明了选择性外延层的厚度接近1000。在最终研究中,研究了反应堆放大策略。使用超音速自由喷射阵列将多晶硅膜均匀地沉积在3 ' '晶片上。根据蒙特卡洛模拟选择光源的几何形状,并通过光束通量和薄膜生长速率测量来测试其精度。实验上,从源头得到的通量分布与模型预测进行了很好的比较。

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