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Characterization and modeling of electrostatically actuated polysilicon micromechanical devices.

机译:静电驱动多晶硅微机械装置的表征和建模。

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Sensors, actuators, transducers, microsystems and MEMS (MicroElertroMechanical Systems) are some of the terms describing technologies that interface information processing systems with the physical world. Electrostatically actuated micromechanical devices are important building blocks in many of these technologies. Arrays of these devices are used in video projection displays, fluid pumping systems, optical communications systems, tunable lasers and microwave circuits.; Well-calibrated simulation tools are essential for propelling ideas from the drawing board into production. This work characterizes a fabrication process—the widely-used polysilicon MUMPs process—to facilitate the design of electrostatically actuated micromechanical devices. The operating principles of a representative device—a capacitive microwave switch—are characterized using a wide range of electrical and optical measurements of test structures along with detailed electromechanical simulations. Consistency in the extraction of material properties from measurements of both pull-in voltage and buckling amplitude is demonstrated. Gold is identified as an area-dependent source of nonuniformity in polysilicon thicknesses and stress. Effects of stress gradients, substrate curvature, and film coverage are examined quantitatively.; Using well-characterized beams as in-situ surface probes, capacitance-voltage and surface profile measurements reveal that compressible surface residue modifies the effective electrical gap when the movable electrode contacts an underlying silicon nitride layer. A compressible contact surface model used in simulations improves the fit to measurements. In addition, the electric field across the nitride causes charge to build up in the nitride, increasing the measured capacitance over time. The rate of charging corresponds to charge injection through direct tunneling.; A novel actuator that can travel stably beyond one-third of the initial gap (a trademark limitation of conventional actuators) is demonstrated. A “folded capacitor” design, requiring only minimal modifications to the layout of conventional devices, reduces the parasitic capacitances and modes of deformation that limit performance. This device, useful for optical applications, can travel almost twice the conventional range before succumbing to a tilting instability.
机译:传感器,执行器,换能器,微系统和MEMS(微机电系统)是描述将信息处理系统与物理世界接口的技术的一些术语。在许多这些技术中,静电驱动的微机械设备是重要的组成部分。这些设备的阵列用于视频投影显示器,流体泵系统,光通信系统,可调谐激光器和微波电路。良好校准的仿真工具对于将创意从绘图板推进到生产至关重要。这项工作的特点是一种制造过程-广泛使用的多晶硅MUMPs过程-有助于静电致动微机械设备的设计。代表性设备(电容式微波开关)的工作原理是通过对测试结构进行广泛的电气和光学测量以及详细的机电模拟来表征的。从引入电压和屈曲幅度的测量中证明了在提取材料特性方面的一致性。金被认为是多晶硅厚度和应力不均匀的区域依赖性来源。定量检查应力梯度,基材曲率和薄膜覆盖率的影响。使用特征明确的光束作为原位表面探针,电容电压和表面轮廓测量显示,当可移动电极接触下面的氮化硅层时,可压缩的表面残留物会改变有效的电间隙。模拟中使用的可压缩接触表面模型可改善对测量的拟合度。另外,穿过氮化物的电场会导致电荷在氮化物中累积,从而随时间增加测量电容。充电速率对应于通过直接隧穿注入的电荷。展示了一种新型致动器,该致动器可以稳定地移动超过初始间隙的三分之一(传统致动器的商标限制)。 “折叠电容器”设计只需要对常规器件的布局进行最小的改动,就可以减少寄生电容和限制性能的变形模式。该器件可用于光学应用,在屈服于倾斜不稳定性之前,其行程几乎是传统范围的两倍。

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