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Thermo-structural behavior of adhesively bonded microelectronic chips.

机译：粘合微电子芯片的热结构行为。

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摘要

In recent years, flip-chip technology has migrated to systems using laminated substrates to create Direct Chip Attach (DCA) configurations. DCA configurations have many advantages over existing technologies, but are vulnerable to thermally induced strains and the resulting solder joint fatigue.; The analytical aspects of this study focuses on the development of a rigorous fully-coupled physically-consistent linear-elastic thermostructural model of a tri-layer structure. The imposition of force and moment balance on the structure and use of an axial and shear stiffness (or spring-constant like) representation of the compliant, middle layer makes it possible to accurately represent the stress and strain in the compliant layer of a tri-layer structure, operating between two thermal end states.; Use of the Coffin-Manson solder fatigue relation is extended to underfilled flip-chip and DCA configurations, where the solder is embedded in an elastomeric material. Application of this relation to underfilled direct chip attach configurations, using analytically- and numerically-derived solder strain results, reveals that the dramatic improvement in fatigue life of solder joints reported in the literature for underfilled configurations can be related to solder shear strain reduction.; The numerical tasks performed in this study serve to verify the analytical model and results, and shed considerable light on the thermostructural behavior of underfilled DCA packaging configuration.; Experimental measurements of failure loads for a thin layer of a die-attach or underfill material are performed for a large number of specimens. This is one of the first systematic studies to present load measurements for a die-attach or underfill material, under combined loading conditions.
机译：近年来，倒装芯片技术已迁移到使用层压基板来创建直接芯片连接（DCA）配置的系统。 DCA配置具有超过现有技术的许多优点，但易受热引起的应变并导致焊点疲劳。这项研究的分析方面侧重于开发严格的完全耦合的三层结构的物理一致的线性弹性热结构模型。在结构上施加力和力矩平衡，并使用顺应性中间层的轴向和剪切刚度（或类似弹簧常数）表示法，可以精确地表示三重结构顺应性层中的应力和应变。层结构，在两个热最终状态之间运行。 Coffin-Manson焊料疲劳关系的使用扩展到底部填充的倒装芯片和DCA配置，其中焊料被嵌入弹性材料中。利用分析和数值推导的焊接应变结果，将这种关系应用于未填充的直接芯片连接结构，发现文献中针对未填充的结构所报告的焊点疲劳寿命的显着改善可能与降低焊料剪切应变有关。在这项研究中执行的数值任务用于验证分析模型和结果，并为未充分填充的DCA包装配置的热结构行为提供了可观的启示。对大量的样品进行了模具连接或底部填充材料薄层的破坏载荷的实验测量。这是在组合负载条件下提供芯片连接或底部填充材料的负载测量的第一批系统研究之一。

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  • 作者

    Gektin, Vadim.;

  • 作者单位

    University of Minnesota.;

  • 授予单位 University of Minnesota.;
  • 学科 Engineering Mechanical.; Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1997
  • 页码 153 p.
  • 总页数 153
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 机械、仪表工业;无线电电子学、电信技术;
  • 关键词

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