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首页> 外文学位 >Microelectronic and micromechanical sensors and actuators in CMOS technology: A novel scheme towards regularization and integration.
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Microelectronic and micromechanical sensors and actuators in CMOS technology: A novel scheme towards regularization and integration.

机译：CMOS技术中的微电子和微机械传感器与执行器：一种针对正则化和集成的新颖方案。

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摘要

Present day integrated circuit (IC) as well as sensor technology stem from silicon microelectronic processing with one marked difference in their direction of progress. IC technology is being developed in the direction of commercial accessibility, while the sensor technology still relies upon customization of fabrication techniques and consequently its development is restricted to selected research groups. An attempt has been made to overcome this serious limitation by regularizing the microsensor fabrication scheme using a commercially well-established IC technology. A simple, yet powerful approach has emerged as a result of this attempt. Many inherent features of commercial CMOS technology have been identified and found to be ideally suited for microsensor fabrication. Based on these features, a special sensor layout design procedure has been introduced to achieve complete compatibility with the CMOS technology, without altering any of the CMOS process sequences. Under this scheme, fabrication of sensors and actuators has become possible in just two steps, namely layout design step and a single post-processing step. The approach leads to several advantages. First, the major obstacle for the progress of the sensor development is overcome by eliminating the requirement for customized fabrication facilities. Secondly, a direction has been set forth to regularize the sensor fabrication approach as it exists in today's integrated circuit technology. This implies that sensors and actuators of different kinds are realizable using a fixed technique. Thirdly, realization of integrated sensor systems with on-chip electronics becomes easily feasible since the circuit forming capabilities of the CMOS process remain unaffected in the entire scheme.;Several devices have been successfully fabricated and tested using this scheme. The devices include integrated humidity sensors and micromechanical structures such as bare polysilicon microbridges, sandwiched oxide microbridges, cantilevers and suspended plates. Functional devices such as electro-thermal gas flow sensors, thermal and visible radiation sources and electro-thermal microactuators have also been realized using the sandwiched oxide micromechanical structures. The on-chip circuit integration capabilities have been demonstrated by various designs and tests. The functioning of the fabricated devices has been studied systematically and the results are reported. A simple analytical scheme has been developed to model the thermally isolated micromechanical structures. Modeling results are compared with various experimental results.
机译：当今的集成电路（IC）和传感器技术源于硅微电子加工，其发展方向存在明显差异。 IC技术正在朝着商业可获取性的方向发展，而传感器技术仍然依赖于制造技术的定制化，因此其发展仅限于某些研究小组。已经尝试通过使用商业上公认的IC技术规范化微传感器制造方案来克服这一严重限制。通过这种尝试，出现了一种简单而强大的方法。已经确定了商业CMOS技术的许多固有特征，并发现它们非常适合微传感器制造。基于这些功能，引入了一种特殊的传感器布局设计程序，以实现与CMOS技术的完全兼容性，而无需更改任何CMOS工艺流程。在该方案下，仅需两个步骤即可制造传感器和执行器，即布局设计步骤和单个后处理步骤。该方法具有几个优点。首先，通过消除对定制制造设施的需求，克服了传感器开发进展的主要障碍。其次，已经提出了使传感器制造方法规范化的方向，就像当今的集成电路技术中存在的那样。这意味着可以使用固定技术来实现不同类型的传感器和执行器。第三，由于在整个方案中不影响CMOS工艺的电路形成能力，因此实现具有片上电子器件的集成传感器系统变得容易可行。;已经使用该方案成功制造和测试了多个器件。这些设备包括集成的湿度传感器和微机械结构，例如裸露的多晶硅微桥，夹层氧化物微桥，悬臂和悬浮板。使用夹层氧化物微机械结构也已经实现了诸如电热气体流量传感器，热和可见辐射源以及电热微致动器之类的功能装置。片上电路集成功能已通过各种设计和测试得到证明。系统地研究了所制造设备的功能，并报告了结果。已经开发出一种简单的分析方案来对热隔离的微机械结构进行建模。将建模结果与各种实验结果进行比较。

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  • 作者

    Parameswaran, Meenakshinathan.;

  • 作者单位

    University of Alberta (Canada).;

  • 授予单位 University of Alberta (Canada).;
  • 学科 Engineering Electronics and Electrical.
  • 学位 Ph.D.
  • 年度 1990
  • 页码 144 p.
  • 总页数 144
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 老年病学;
  • 关键词

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