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首页> 外文学位 >THE GROWTH OF COPPER - CHROMIUM METASTABLE ALLOYS BY BIAS SPUTTERING: EFFECT OF SUBSTRATE BIAS AND ALLOY COMPOSITION ON SOLUBILITY AND MORPHOLOGY.
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THE GROWTH OF COPPER - CHROMIUM METASTABLE ALLOYS BY BIAS SPUTTERING: EFFECT OF SUBSTRATE BIAS AND ALLOY COMPOSITION ON SOLUBILITY AND MORPHOLOGY.

机译：偏置溅射法生长铜-铬亚稳合金：基体偏置和合金组成对溶解度和形态的影响。

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摘要

Cu-Cr metastable alloys are interesting both from a basic science viewpoint (i.e., alloy theory for elements with very limited mutual liquid and solid solubilities) and from a technological viewpoint (i.e., "stainless" copper for corrosion and thin film circuit fabrications). Single phase Cu-Cr metastable alloys have been successfully grown by bias rf sputtering. The effect of substrate bias and film composition on the early stages of film growth, on the film microstructure and morphology, and on the phase transformation process of the metastable films were studied using (S)TEM, SEM, AES, SIMS, ISS, WDX, X-ray diffraction, and resistivity measurements. The solid solubilities at room temperature were extended from less than 0.04 atomic percent to as much as 45 atomic percent. Cu-rich films were FCC and Cr-rich films were BCC. The lattice parameters of these films showed Vegard's law behaviour. Increase in substrate bias and in temperature caused preferential sputtering and evaporation of solute atoms, resulting in reduction of solubility and formation of two phases. The morphology and microstructures depended on film composition and very sensitively on substrate bias. Finally, a metastable phase map, a morphology model, and a growth rate model as functions of substrate bias and film composition were proposed. The map and the models could be used to predict how processing variables will affect the film's optical, electrical, mechanical and corrosive properties.
机译：从基本的科学观点（即，互溶性和固溶性非常有限的元素的合金理论）和从技术的观点（即，用于腐蚀和薄膜电路制造的“不锈钢”铜）来看，Cu-Cr亚稳合金都是令人感兴趣的。单相Cu-Cr亚稳合金已经通过偏压射频溅射成功地生长。使用（S）TEM，SEM，AES，SIMS，ISS，ISS，WDX研究了衬底偏压和膜组成对膜生长的早期，膜的微观结构和形态以及亚稳膜的相变过程的影响。 ，X射线衍射和电阻率测量。室温下的固体溶解度从小于0.04原子百分比扩展到高达45原子百分比。富铜膜为FCC，富铬膜为BCC。这些薄膜的晶格参数表明了维加德定律的行为。衬底偏压和温度的升高会导致优先溅射和溶质原子蒸发，从而导致溶解度降低和两相形成。形态和微结构取决于膜的组成，并且非常敏感地取决于衬底的偏压。最后，提出了亚稳态相图，形态模型和生长速率模型，作为衬底偏压和膜组成的函数。该图和模型可用于预测处理变量将如何影响薄膜的光学，电，机械和腐蚀性质。

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  • 作者

    SHIN, SANG MO.;

  • 作者单位

    University of Illinois at Urbana-Champaign.;

  • 授予单位 University of Illinois at Urbana-Champaign.;
  • 学科 Engineering Materials Science.
  • 学位 Ph.D.
  • 年度 1987
  • 页码 127 p.
  • 总页数 127
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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