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Polyurethane-Based Conformal Coatings for Tin Whisker Mitigation

机译：减轻锡晶须的聚氨酯基保形涂料

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摘要

Tin whisker growth phenomenon, which can cause high reliability risks to disable the function of electronic components, becomes a serious concern in lead free electronics. Conformal coatings, which have been used to protect electronics from high humidity and corrosive environments, can thus be an effective candidate to mitigate the tin whisker growth. In this study, the effects of curing conditions and electron beam irradiation on the structural evolution and mechanical properties of polyurethane (PU)-based conformal coatings, which will influence the mitigation ability of conformal coating on tin whisker growth, were investigated by FTIR, Raman, DSC and mechanical test. The results show that the mechanical properties of PU-based conformal coating can be controlled by the various curing condition and the coating degradation and brittleness are obtained after electron beam irradiation. Adhesion property between PU-based conformal coating and tin is another important factor to influence the mitigation ability of conformal coating on tin whisker growth. Four-point bending test was used in this research to calculate the interfacial adhesion energy between PU-based conformal coating and tin surface for adhesion characterization. The result shows that polyurethane acrylate (PUA) has poorer adhesion than PU on tin surface. In an effort to enhance the PUA adhesion, a silane agent ((3-Aminopropyl)triethoxysilane) was introduced to chemically bond PUA to the tin surface. At last, in order to further establish the effect of coating adhesion and mechanical properties on the tin whisker mitigation function, this study exposed various PU and PUA conformal coatings that were applied on the tin-plated copper coupons for long term (up to 5000 hours), high temperature and high humidity (HTHH) storage at 85°C and 85%RH. After HTHH storage, microstructural developments in tin layer, coating degradation, tin surface oxidation, coating adhesion on tin surface and electron beam irradiation effect were analyzed to compare the mitigation ability of various conformal coatings on tin whisker growth. The results show that good adhesion and optimum mechanical properties are necessary for enhanced tin whisker mitigation and electron beam irradiation weakens the mitigation ability of conformal coating on tin whisker growth.
机译：锡晶须生长现象会导致高可靠性风险，从而使电子组件的功能失效，这已成为无铅电子产品中的一个严重问题。因此，用于保护电子器件免受高湿和腐蚀性环境影响的保形涂层可以有效减轻锡晶须的生长。在这项研究中，通过FTIR，拉曼光谱研究了固化条件和电子束辐照对聚氨酯（PU）基保形涂料结构演变和力学性能的影响，这将影响保形涂料对锡晶须生长的缓解能力。 ，DSC和机械测试。结果表明，可以通过各种固化条件来控制PU基保形涂料的机械性能，并且在电子束辐照后可以获得涂层的降解和脆性。 PU基保形涂料与锡之间的粘合性能是影响保形涂料对锡晶须生长的缓解能力的另一个重要因素。本研究采用四点弯曲试验计算PU基保形涂料与锡表面之间的界面粘合能，以表征粘合性能。结果表明，聚氨酯丙烯酸酯（PUA）在锡表面的粘合性比聚氨酯差。为了增强PUA的粘附性，引入了硅烷试剂（（3-氨基丙基）三乙氧基硅烷）以将PUA化学键合至锡表面。最后，为了进一步确定涂层附着力和机械性能对锡晶须缓解功能的影响，本研究暴露了各种长期涂在镀锡铜试样上的PU和PUA保形涂料），高温高湿（HTHH）储存在85°C和85％RH。 HTHH储存后，分析了锡层的微观结构发展，涂层降解，锡表面氧化，锡表面上的涂层附着力以及电子束辐照效果，以比较各种共形涂层对锡晶须生长的缓解能力。结果表明，良好的附着力和最佳的机械性能对于增强锡晶须的缓解是必不可少的，而电子束辐照会削弱保形涂层对锡晶须生长的缓解能力。

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  • 作者

    Dong, Fei.;

  • 作者单位

    State University of New York at Binghamton.;

  • 授予单位 State University of New York at Binghamton.;
  • 学科 Materials science.
  • 学位 Ph.D.
  • 年度 2018
  • 页码 146 p.
  • 总页数 146
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 水产、渔业;
  • 关键词

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