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Long-term thermal aging of parylene conformal coating under high humidity and its effects on tin whisker mitigation

机译：高湿度下对二甲苯共形涂层的长期热老化及其对锡须缓解的影响

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摘要

Usage of pure tin (Sn) or Sn-rich alloy in electronics industry is growing, which makes them more susceptible to the spontaneous growth of tin whiskers. The risk of having these whiskers can be dramatically mitigated by applying a conformal coating such as parylene C. The purpose of this paper is to investigate the degradation of parylene C coating (with two thicknesses, 12.5 μm and 25 μm) during thermal aging in high humidity environment (85 °C/85% relative humidity for up to 5000 h) and its effect on the tin whisker mitigation property. It was observed that under the high temperature and high humidity (HTHH) environment, the oxidation occurs at early times, followed by bond scission, resulting in the loss in strength and modulus of the parylene coating. After 2500 h of aging, due to the degradation of the silane agent at the tin/parylene interface, the adhesion of the parylene coating on the tin surface was significantly weakened, which resulted in extensive corrosion of the tin solderpads. The loss of adhesion of the coating, along with the corrosion of the tin surface facilitated tin whisker nucleation at the interface while the loss of mechanical strength and the brittleness made the growing whiskers penetrate easily through the coating. Tin whiskers with a smaller diameter were buckled and grew along the delaminated interfacial region while those with a larger diameter penetrated and continued to grow through the coating. Although the thicker parylene coating helped delay the complete penetration and increase the critical diameter of whiskers for complete penetration, it showed more tin whisker activities and easy penetration by large diameter whiskers due to poorer adhesion. Hence, the effectiveness of the parylene coating on tin whisker mitigation will depend on its degradation kinetics of mechanical properties and adhesion under such harsh conditions.
机译：电子工业中纯锡（Sn）或富含Sn的合金的用途增长，使它们更容易受到锡须自发生长的影响。通过施加聚成型涂层如聚合物C，可以显着减轻具有这些晶须的风险。本文的目的是在高温老化期间研究聚对二甲苯C涂层（具有两厚度，12.5μm和25μm）的降解湿度环境（85°C / 85％相对湿度高达5000小时）及其对锡晶须缓解特性的影响。观察到，在高温和高湿度（HTHH）环境下，氧化在早期发生，然后进行粘合裂变，导致对二甲苯涂层的强度和模量的损失。在2500小时后，衰老后，由于锡/二甲烯界面下的硅烷试剂的降解，对二甲苯涂层对​​锡表面上的粘附性显着削弱，这导致锡焊料焊接的广泛腐蚀。涂层的粘合性丧失，以及锡表面促进的锡晶须在界面中的腐蚀，而机械强度和脆性的损失使得生长的晶须通过涂层容易地穿透。具有较小直径较小的锡晶须沿着分层的界面区域弯曲并成长，而直径较大的那些渗透并继续通过涂层生长。较厚的聚对二甲苯涂层有助于延迟完全穿透并增加晶须的临界直径，以便完全穿透，由于粘附较差的粘附，它显示出更多的锡须活动和大直径晶须的易于穿透。因此，对二烷晶须缓解对二甲苯涂层的有效性取决于其在这种苛刻条件下的机械性能和粘附的降解动力学。

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  • 来源
    《Polymer Degradation and Stability》 |2021年第9期|109667.1-109667.14|共14页
  • 作者

    Preeth Sivakumar; Surbhi Mahajan Du; Matt Selter; Imani Ballard; John Daye; Junghyun Cho;

  • 作者单位

    Department of Mechanical Engineering State University of New York (SUNY) at Binghamton NY 13902 United States;

    Honeywell FM&T Kansas City National Security Campus Kansas City MO 64147 United States;

    Honeywell FM&T Kansas City National Security Campus Kansas City MO 64147 United States;

    Honeywell FM&T Kansas City National Security Campus Kansas City MO 64147 United States;

    Honeywell FM&T Kansas City National Security Campus Kansas City MO 64147 United States;

    Department of Mechanical Engineering State University of New York (SUNY) at Binghamton NY 13902 United States Materials Science and Engineering Program State University of New York (SUNY) at Binghamton NY 13902 United States;

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  • 正文语种 eng
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  • 关键词

    Parylene; Tin whiskers; Coating degradation; Adhesion; High-temperature; High-humidity; Aging;

    机译：聚糖;锡须;涂层降解;粘附;高温;高湿度;老化;

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