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The effects of environmental stresses on the reliability of flexible and standard termination multilayer ceramic capacitors.

机译：环境应力对柔性和标准端接多层陶瓷电容器可靠性的影响。

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摘要

Flexible termination capacitors were designed to reduce stresses transmitted to the ceramic dielectric of a capacitor and thereby prevent flex cracking. Two studies were conducted to examine the reliability of flexible termination multilayer ceramic capacitors (MLCCs) subjected to environmental stresses. The first study used temperature-humidity-bias to compare the effects of termination type (standard vs. flexible), presence of a conformal coating (acrylic coating vs. no coating), and voltage bias level. In situ monitoring demonstrated similar failure statistics between the flexible and standard termination capacitors, presence of conformal coating, and voltage bias level. Upon removal from THB conditions recovery occurred only in the standard termination MLCCs. Flexible termination capacitors at the rated voltage bias were found to have more permanent failures after exposure to THB testing as compared to standard termination capacitors. Failure analysis indicated that silver and palladium migration between electrodes was the failure mechanism in the biased flexible termination capacitors.;In the second study flexible and standard termination MLCCs experienced a storage test in which they were exposed to elevated temperature and humidity conditions. It was found that the standard termination MLCCs had a lower reliability with the majority of the MLCCs failing compared to the flexible termination MLCCs where only one MLCC failed. Nearly all failures were for insulation resistance with few capacitors failing for other parameters. Subsequent bake-out of the MLCCs showed some recovery, however more failures were still occurring in the standard termination MLCCs compared to the flexible termination MLCCs. X-ray photoelectron spectroscopy and cross-sectioning were used to examine the failure mechanisms of the capacitors. A bulk migration of silver into the dielectric was determined to be one of the failure mechanisms in the capacitors.
机译：柔性端接电容器的设计旨在降低传递到电容器陶瓷电介质的应力，从而防止挠曲裂纹。进行了两项研究，以检验承受环境应力的柔性终端多层陶瓷电容器（MLCC）的可靠性。第一项研究使用温度-湿度偏差来比较端接类型（标准涂层与柔性涂层），保形涂层的存在（丙烯酸涂层与无涂层）以及电压偏置水平的影响。现场监测表明，柔性和标准端接电容器，保形涂层的存在以及电压偏置水平之间的故障统计数据相似。从THB条件中删除后，仅在标准终端MLCC中发生恢复。与标准端接电容器相比，发现在额定电压偏置下的柔性端接电容器在经受THB测试后具有更多的永久性故障。失效分析表明，电极间的银和钯迁移是偏压柔性终端电容器的失效机理。在第二项研究中，柔性和标准终端MLCC经历了储存测试，暴露于高温高湿条件下。已发现，与仅一个MLCC发生故障的灵活终端MLCC相比，标准终端MLCC的可靠性较低，大多数MLCC发生故障。几乎所有故障都与绝缘电阻有关，很少有电容器因其他参数而故障。随后对MLCC的烘烤显示出了一定程度的恢复，但是与灵活端接MLCC相比，标准端接MLCC仍然发生更多的故障。 X射线光电子能谱和横截面用于检查电容器的失效机理。银大量迁移到电介质中被确定为电容器中的故障机制之一。

著录项

  • 作者

    Brock, Garry Robert, Jr.;

  • 作者单位

    University of Maryland, College Park.;

  • 授予单位 University of Maryland, College Park.;
  • 学科 Engineering Mechanical.;Engineering Electronics and Electrical.
  • 学位 M.S.
  • 年度 2009
  • 页码 68 p.
  • 总页数 68
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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