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首页> 美国卫生研究院文献>Micromachines >Effects of the Manufacturing Process on the Reliability of the Multilayer Structure in MetalMUMPs Actuators: Residual Stresses and Variation of Design Parameters
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Effects of the Manufacturing Process on the Reliability of the Multilayer Structure in MetalMUMPs Actuators: Residual Stresses and Variation of Design Parameters

机译：制造工艺对MetalMUMPs执行器中多层结构可靠性的影响：残余应力和设计参数的变化

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摘要

Potential problems induced by the multilayered manufacturing process pose a serious threat to the long-term reliability of MEMSCAP® actuators under in-service thermal cycling. Damage would initiate and propagate in different material layers because of a large mismatch of their thermal expansions. In this research, residual stresses and variations of design parameters induced by metal multi-user micro electromechanical system processes (MetalMUMPs) were examined to evaluate their effects on the thermal fatigue lifetime of the multilayer structure and, thus, to improve MEMSCAP® design. Since testing in such micro internal structure is difficult to conduct and traditional testing schemes are destructive, a numerical subdomain method based on a finite element technique was employed. Thermomechanical deformation from metal to insulator layers under in-service temperature cycling (obtained from the multiphysics model of the entire actuator, which was validated by experimental and specified analytical solutions) was accurately estimated to define failures with a significant efficiency and feasibility. Simulation results showed that critical failure modes included interface delamination, plastic deformation, micro cracking, and thermal fatigue, similarly to what was concluded in the MEMSCAP® technical report.
机译：在使用中的热循环条件下，多层制造工艺引起的潜在问题严重威胁了MEMSCAP ®执行器的长期可靠性。由于材料的热膨胀不匹配，会在不同的材料层中引发并传播破坏。在这项研究中，研究了金属多用户微机电系统工艺（MetalMUMP）引起的残余应力和设计参数的变化，以评估其对多层结构热疲劳寿命的影响，从而改善MEMSCAP ® 设计。由于在这样的微观内部结构中难以进行测试并且传统的测试方案具有破坏性，因此采用了基于有限元技术的数值子域方法。在使用中的温度循环下（从整个执行器的多物理场模型获得，并通过实验和指定的分析解决方案进行了验证）准确地估计了从金属层到绝缘体层的热机械变形，从而以很高的效率和可行性确定了故障。仿真结果表明，关键的失效模式包括界面分层，塑性变形，微裂纹和热疲劳，与MEMSCAP ®技术报告中得出的结论相似。

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