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Advanced process technology for the removal of patterned ion implanted photoresist in integrated circuit manufacturing

机译：先进的工艺技术，用于在集成电路制造中去除图案化的离子注入光刻胶

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作者
Vemula, Sri Charan;
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作者单位

University of Houston;

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授予单位 University of Houston;
学科
学位 Ph.D.
年度 2011
页码 70 p.
总页数 70
原文格式 PDF
正文语种 eng
中图分类
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专利

1. Preparation of photosensitive polyimides (PSPIs) and their feasible evaluation for lithographic insulation patterns (LIPs) of integrated circuits (ICs) without negative photoresists [J] . Meng-Hsin Chen, Chiu-Chun Lai, Hsin-Lung Chen, Materials science in semiconductor processing . 2018,第期

机译：没有负光刻胶的光敏聚酰亚胺（PSPI）的制备及其对集成电路（IC）的光刻绝缘图案（嘴唇）的可行评价
2. The Application of Rapid Thermal Processing Technology to the Manufacture of Integrated Circuits-An Overview [J] . BRATSCHUN ALAN Journal of Electronic Materials . 1999,第12期

机译：快速热处理技术在集成电路制造中的应用概述
3. The Application of Rapid Thermal Processing Technology to the Manufacture of Integrated Circuits--An Overview [J] . ALAN BRATSCHUN Journal of Electronic Materials . 1999,第12期

机译：快速热处理技术在集成电路制造中的应用-综述
4. Dry Strip Process Technology for Removal of Heavily Implanted Photoresist For 180nm Technology and Beyond [C] . Qingyuan Han, Teresa Bausum, Palani Sakthivel, SEMICON China 2003 Technology Symposium: Technical Programs for the Semiconductor Equipment and Materials Industries . 2003

机译：干式剥离工艺技术，用于去除180nm及以后的大量注入的光刻胶
5. Lithographic performance and application of i-line and DUV photoresists for advanced integrated circuit technology. Thulium dioctyl terephthalate(5-) as an extracellular space marker and NMR shift reagent for quantitative determination of tissue. The chemistry of chromium(IV) in a constructed wetland. [D] . Makos, Janice D. 1996

机译：i-line和DUV光刻胶的光刻性能及其在先进集成电路技术中的应用。对苯二甲酸二辛酯（5-）作为细胞外空间标记物和NMR移位试剂，用于定量测定组织。人工湿地中铬（IV）的化学性质。
6. Recent Achievements in Dyes Removal Focused on Advanced Oxidation Processes Integrated with Biological Methods [O] . Stanisław Ledakowicz, Katarzyna Paździor 2021

机译：最近的染料去除成果集中于与生物方法集成的晚期氧化过程
7. New Technologies for Scaled-down Cu Interconnection in Ultra-Large Scale Integrated Circuits. New Advanced Cu Deposition Process with Long Throw Sputtering. [O] . Kazuo TAKAKUWA 1998

机译：超大型集成电路中缩小CU互连的新技术。新型先进的Cu沉积过程，长时间抛出溅射。

Advanced process technology for the removal of patterned ion implanted photoresist in integrated circuit manufacturing

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