A multi-layer stack capacitance is designed and fabricated which is applied to infrared fo -cal plane array readout circuit ( IRFPA ROIC) .The test results indicate that the unit-area stack capaci-tance increases more than two times compared with the single -form capacitance, which enhances the ca-pacity of charge storage for IRFPA ROIC .Moreover , a SPICE model for the stack capacitance is built to describe its electrical characteristic , and the root mean square error ( RMSE) of the SPICE model is less than 2%.Therefore , it can describe the electrical characteristic of the stack capacitance accurately and meet the requirements of the simulation design of IRFPA ROIC .%基于0沣．5μm CMOS工艺设计并制备了一种应用于红外焦平面读出电路的多层堆叠（ stack）电容结构，测试结果表明，相比单一形式电容，stack电容的单位面积值增大两倍以上，因而能够有效地提升红外焦平面读出电路的电荷存储能力。此外，本文还为设计的多层stack电容建立了一套描述其电学特性的 SPICE模型，模型均方根误差在2％以内，因此可以准确描述stack电容的电学特性，满足了红外焦平面读出电路的仿真设计要求。
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