Mirco ultrasonic machining is an unique non-traditional manufacturing process because it can produce micro/precision components and parts made of high temperature-resistant,wear-resistant,hard and brittle materials,for instance,semiconductors,optical glass and engineering ceramics.This review mainly focuses on the current research work related to material removal mechanism,processing techniques and enabling technologies in China and abroad,and the trend of this technology as well.%微细超声加工技术适用于半导体、光学玻璃、工程陶瓷等各种高强度、耐高温、耐磨损硬脆材料元器件的精密微细制造.本文针对其材料去除机制、加工方法以及使能技术的国内外研究和应用现状,进行了系统介绍,并对该技术的发展趋势进行了展望.
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