A novel heat released microcapsule-type latent curing agent was successfully prepared by solvent evaporation technique with 2-phenylimidazole （2PZ） as core material and polyglycidyl methacrylete （PGMA） as wall material. The chemical structure, core material content, surface morphology, size distribution and curing characteristics of as-prepared microcapsule-type curing agent were characterized by FT-IR, TGA, SEM, granulometer and DSC. The microcapsules had a smooth surface and displayed a narrow size distribution with the mean size of 17. 6μm, and their wall thickness was about 1.1μm with core material content about 20. 1 （wt） %. In addition, the one-component adhesive made from the microcapsules and epoxy resin E-51 showed advanced curing characteristics, latent properties and bonding performance. The E-51/PGMA microcapsule system can be cured at 100℃ in 30rain and its shelf life at room temperature is more than 33 days with its tensile shear strength about 15.36MPa.%以2-苯基咪唑（2PZ）为芯材,聚甲基丙烯酸缩水甘油酯（PGMA）为壁材,采用溶剂挥发技术,成功地制备了一种新型潜伏性热释放型微胶囊固化剂2PZ-PGMA。通过FT-IR、TGA、SEM、粒度分析和DSC对微胶囊固化剂的化学结构、芯材含量、表面形貌、粒径分布及固化性能等进行了表征。所制备的微胶囊固化剂表面光滑,粒径分布较窄,平均粒径为约17.6μm,壁材厚度为约1.1μm,芯材2PZ含量为20.1（wt）%。由微胶囊固化剂与环氧树脂E-51制备的单组分胶粘剂,具有优良的固化特性、潜伏性能和粘接性能,可在100℃下30min内实现固化,室温储存期达33d以上,拉伸剪切强度达15.36MPa。
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