Objective: To explore the adhesion effect between the resin and the silicon soft reliner by changing diameter and distribution of the holes on resin surface, in order to get an easy and reliable method that could improve the adhesion effect of silicon soft reliner. Methods: Self-curing resin plates either with holes along the edge or with full of holes. The requirements of holes'distribution were as follows: edge distance was lmm; diameter of the hole was 1.0mm 1.5mm、 2.0mm respectively in the subgroup; pitch of holes was 2mm; thickness of holes was 1.0mm. Two resin plates with the same parameters were placed facing to each other with 1.5mm soft reliner between them forming sandwich structure. Detachment stresses were measured using improved L type tensile test followed by statistical analysis. Results: It was shown that there was no significant difference of detachment stresses between each two groups with different diameter holes, and also with different holes' distribution in 1.5mm diameter group. In the 2.0mm diameter group, there was statistic difference of detachment stresses between group with no hole and group with holes along the edge. Conclusion: It is known that digging holes on the resin surface could improve the adhesion effect of silicon soft reliner. As to the results of present paper, it is recommended to using holes along the resin edge to improve adhesion effect of silicon soft reliner on resin.%目的:探讨改变树脂表面形态中孔的直径以及分布后其与硅橡胶软衬材料的粘接效果,获取一种增加硅橡胶软衬材料牯接强度的简便可靠的方法.方法:利用模具制作3.6×2.5×3.0mm3的带孔的自凝树脂板,要求如下:边距1mm、孔的直径分别为1.0mm、1.5mm、2.0mm,间隔2mm,孔的厚度为1.0mm;同等型号的树脂板相对,中间加1.5mm的软衬材料,形成“三明治”结构,利用改良的“L”型拉伸实验进行剥脱力值的测定,并进行统计学分析；选择第一组实验中力值较大的一组直径制作全部打孔和周边打孔两组树脂板,重复实验并进行统计学分析;任选一个直径制作平板组和周边打孔组,制作“三明治”结构,然后利用拉伸实验进行剥脱力值的测定,并对所得的数值进行统计分析.结果:三组直径的全部打孔组剥脱力值分别为512.64±231.44572N、463.75±98.90334N与480.85±47.84115,差异无统计学意义; 1.5mm组的全部打孔和周边打孔组剥脱力值为469.26±94.83642N与440.09±56.60532N,差异无统计学意义;2.0mm组的平板组和周边打孔组剥脱力值为625.68±72.19835N与688.52±85.89314N,差异有统计学意义.结论:利用树脂界面打孔增加硅橡胶类软衬材料的牯接强度确实可行;鉴于直径为1.0mm、1.5mm、2.0mm组及周边打孔和周边打孔的剥脱力值相当,可直接采用周边打孔增加粘接强度.
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