During purifying silicon wafer cutting fluid with ion exchange resin, the ion exchange resin is often polluted by organic compounds and iron ion to cause ion exchange resin deactivation .In this paper, the ion exchange resin was activated by using different regeneration processes,which can improve ion exchange capacity. Reasons and characteristics of ion exchange resin pollution were discussed as well as activation processes and influencing factors of ion exchange capacity. Application prospect of ion exchange resin in purifying silicon wafer cutting fluid was analyzed.% 在利用离子交换树脂对晶硅片切割液进行提纯的过程中，树脂会受到有机物及铁等的污染而失去离子交换活性。选择不同的再生工艺，对其进行活化处理，使其交换能力大幅度提高。对离子交换树脂污染的原因、特征、活化工艺及离子交换能力的影响因素做了分析探讨。对其在晶硅片切割液生产领域的应用前景做了展望。
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