随着金线价格一路上涨并创下历史新高，大型封装厂正在加大对铜线制程的投入。通过封装厂多年的摸索，发现镀钯铜线是金线很好的替代品。文章分析了镀钯铜线作为键合线材料本身的基本性质，镀钯铜线引线键合的特征和镀钯铜线PCT实验的可靠性。通过分析发现镀钯铜线材料本身有优良的导电和导热特性，同时还有很好的抗氧化性。镀钯铜线在键合过程中需要保护气体的保护，通过硬度实验发现镀钯铜线的硬度较大，因此需要在键合过程中防止弹坑的出现。通过PCT实验证实镀钯铜线具有较好的可靠性。% As is known to all gold wire up all the way to the price and create a new record. The assembly factory intensifies the copper wire process input. Through the many years of exploration, coating Pd copper wire can be very good alternative gold wire. This paper analyzes the copper wire basic property, coating Pd copper wire bonding characteristic and coating Pd copper wire PCT reliability. Through the analysis found that coating Pd copper wire has excellent thermal conductivity features and has very good oxidation resistance. Coating Pd copper wire need protect gas at bonding process. Through hardness test we find coating Pd copper wire has larger hardness so need to prevent the crack at the bonding process. We also find that coating Pd copper wire has better reliability at PCT.
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