在无铅组装工艺中，大多数电路板组装厂优先采用低成本焊料合金。没有添加剂的锡铜无铅焊料本身存在局限性，可是添加某种成份后，就能克服锡铜焊料通常所遇到的不足之处。文章分析了几种锡铜焊料相对于SAC焊料的特点，并叙述了它们在波峰焊和手工焊接工艺中的应用情况。% In Lead-free process, a substantial percentage of PCB assemblers select less costly solder alloys at first. Tin-copper solder without dopants has limitations, but the addition of certain elements helps to eliminate the deficiencies normally seen with tin-copper solder. This paper discusses several tin-copper options and the advantages they offer when compared with SAC based solder. And introduce how to use them in wave-soldering and hand-soldering process.
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