随着电子装备向小型化、轻量化和多功能化方向发展，其内部电子部件/组件集成密度要求不断提升，传统的2D集成密度已接近极限，2.5D/3D集成必将成为新一代电子部件/组件的主流形态。射频垂直互连技术是2.5D/3D集成射频系统的关键技术之一。对芯片级集成射频垂直互连技术的发展动态及应用前景进行了综述。%With the development of the electronic products, the 2D integrated has been not fulfi lled the application. Due to the miniaturized size, lower weight and multifunctional, 2.5D/3D integrated become a trend and necessity. RF vertical interconnection is one of key techniques for 2.5D/3D RF integration. The development of the RF vertical interconnection for chip-scale integrated was summarized.
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