在钎焊温度为820～940℃,钎焊时间为1～30min的条件下,采用TiZrNiCu钎料、Cu/Mo复合中间层对C/C复合材料和TC4进行了钎焊实验.利用扫描电镜及能谱仪对接头的界面组织进行了研究.结果表明:在较低工艺参数下,Cu/C/C复合材料界面结构为Cu/Cu51Zr14/Ti2 (Cu,Ni)+ Ti(Cu,Ni)+ TiCu+ Cu2TiZr/TiC/C/C复合材料.随着工艺参数的提高,TiCu和Cu2TiZr反应相逐渐消失,Ti(Cu,Ni)2新相生成,此时的界面结构为Cu/Cu51Zr14/Ti2 (Cu,Ni)+ Ti(Cu,Ni)+Ti(Cu,Ni)2/TiC/C/C复合材料.钎焊工艺参数较高时界面结构为Cu/Cu51Zr14/Cu(s.s)+Ti(Cu,Ni)2/TiC/C/C复合材料.随着钎焊温度的增加以及保温时间的延长,界面反应层Cu51Zr14和TiC反应层厚度增加.%C/C composite and TC4 were brazed using TiZrNiCu filler metal and Cu/Mo composite in-terlayers at 820-940℃ for l-30min. The interfacial microstructures were investigated by scanning electron microscopy and electron energy spectrum analysis. The results showed that the sequence of the interface structure at low brazing parameters can be described as the following: Cu/Cu51Zr14/Ti2 (Cu, Ni)+Ti(Cu,Ni)+TiCu+Cu2TiZr/TiC/C/C composite. With the increased brazing parameter, TiCu and Cu2TiZr disappeared, and Ti(Cu,Ni)2 appeared. The interface structure was changed to Cu/Cu5i Zri4/Ti2 (Cu,Ni)+Ti(Cu,Ni)+ Ti(Cu,Ni)2/TiC/C/C composite. For high brazing parameters, the interface structure was composed of Cu/Cu51 Zr14/Cu(s. s) + Ti(Cu, Ni)2/TiC/C/C composite. The thickness of Cu51Zr14and TiC reaction layers increased with the increased brazing temperature and the prolonged holding time.
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