采用EBSD技术研究了有、无拉应力作用下无取向硅钢在晶粒长大过程中织构转变及晶界变化的规律.结果表明:在晶粒生长期间,无应力作用下的硅钢中,{111}<112>,{111}<110>织构组分强化,而{100}<001〉织构组分弱化；与无拉应力作用下的情况相比,施加5MPa的拉应力时,{111}<112>,{111}<110>织构组分强化的速率下降,{100}<001>织构组分变化不明显.对于在晶粒生长期间持续变化的{111}<112>,{111}<110>和{100}<001>织构组分而言,虽然有、无拉应力作用下硅钢的{111}<112>和{111}<110>织构组分的高取向差角度晶界频率均下降,而{100}<001>织构组分的高取向差角度晶界频率则上升,但当有拉应力作用后,{111}<112>和{111}<110>织构组分的高取向差角度晶界频率下降的速率变小,{100}<001>织构组分的高取向差角度晶界频率上升的速率稍有变小.通过对无取向硅钢在晶粒长大过程中织构转变及晶界变化规律的研究,分析了合金原子在晶界的偏聚行为.%The rules of texture and grain boundary transformation in the nonoriented silicon steel under applied stress or without applied stress during grain growth were investigated by EBSD. The results show that the {111}<112> and {111} < 110> components in the nonoriented silicon steel without stress are strengthened during grain growth whereas {100} <001> component is weakened, but the growth rate of {111}(112> and {111} < 110> component decreases, while the area fraction of {100}<001> component doesn't change significantly in the sample under stress. For the {111) <112> , {111} <110> and {100} <001> components changing continuously during grain growth, the frequency of high angle mi-sorientation grain boundary of {111} <112> and {111} <110. components decreases, and that of {100} <001> component increases, and whereas the stress being applied in the sample, the frequency decreasing rate of {111} <112> and {111} <110> components rate becomes low and that increasing rate of {100} <001> component becomes a little lower. The segregation behavior of alloying agent in grain boundary was studied.
展开▼
