采用QM-1SP4-CL行星式球磨机将Mo、Cu粉简单混合和机械合金化后进行压片,在1250℃液相烧结1.5h后获得致密的Mo-30Cu合金；添加1.5％硬脂酸作造孔剂的Mo、Cu混合粉压片在1050℃固相烧结1.5h后获得孔隙率为33.186％的Mo-30Cu合金.利用激光热导仪测定所制备的Mo-30Cu合金的热导率.采用Maxwell模型、Hasselman and Johnson模型、单元结构模型和多相系统的传导性计算Mo-30Cu合金的理论热导率值.通过Mo-30Cu合金的热导率实测值与理论值的比较,得出适用于不同工艺状态的Mo-30Cu合金的热导率模型.%Mo and Cu powder were simply mixed or mechanical alloyed by QM-1SP4-CL planet ball-milling, then pressed into tables. In order to obtain tight Mo-30Cu alloy, tables were liquid sintered under 1250 ℃ for 1. 5 h. Mo-30Cu alloy which contained 33. 186% poriness were obtained, when tables which were pressed by Mo and Cu mixed powder added 1. 5% stearic acid had been solid sintered under 1050 ℃ for 1. 5 h. Meanwhile, laser thermal conductance instrument was used to test the thermal conductivity of Mo-30Cu alloy. Maxwell model, Hasselman and, Johnson model, structural unit model and the conductivity of the multiphase system were used to calculate theoretical thermal conductivity of Mo-30Cu alloy. In addtion, through the comparison between experimental thermal conductivity and theoretical thermal conductivity of obtained Mo-30Cu alloy, the model of thermal conductivity applied to various process methods were.
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