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铜铝复合板导电特性的研究

         

摘要

To use numerical integerating method, effect of copper layer distributed on electric nature of Cu-Al-Cu composite plate was studied under the condition of different current and copper layer area ratio. When the sectional sizes and copper layer area are certain, resistance enhancement coefficient of composite plate which copper layer locates at narrowside is less than that of composite plate which copper layer locates at broadside. As current frequency increasing, the resistance enhancement coefficient difference of two composite plate augments in intial stage, then the difference is almost constant. When the copper layer area ratio increases, resistance enhancement coefficient of composite plate whose copper layer locates at narrowside is linearly increasing, while resistance enhancement coefficient of composite plate which copper layer locates at narrowside is slowly reduced in intial stage, then fastly augments.%采用数值积分法,分析了在不同电流频率和铜层面积比条件下铜层分布对铜-铝-铜复合板导电特性的影响.当复合导体的断面尺寸和铜层面积一定时,铜层位于窄边时复合板的电阻增大系数小于铜层位于宽边的复合板;随电流频率的增大,这两种复合板的电阻增大系数之差值先逐渐增大而后基本不变;随铜层面积比的增加,铜层位于宽边时复合导体的电阻增大系数呈线性增长,而铜层位于窄边时复合导体的电阻增大系数先逐步减小而后快速增长.

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