为解决陶瓷表面局部化学镀存在的问题，研制了一种针对氧化铝陶瓷局部化学镀铜前处理用的活化胶，其由具有活化能力的银盐（或钯盐）和粘稠的复合物有机载体组成。将活化胶印于氧化铝陶瓷表面，经500℃高温烧结形成局部活化层后，可直接置于化学镀液中进行镀铜处理，得到与印刷图形一致的局部镀铜层。利用电化学工作站测定样品在化学镀铜溶液中电位随时间的变化情况，考察不同活化条件对Cu2＋还原的催化活性，利用SEM／EDS进行表面形貌及成分分析，确定了活化胶中银盐和钯盐的适宜浓度。结果表明，该两种活化胶应用于氧化铝陶瓷表面化学镀铜的活化工艺，可实现敏化活化的一步化，使陶瓷表面局部化学镀工艺流程简化，成本降低，具有较高的实用价值。%To solve the problem of local chemical plating on the ceramic surface, a glue ink used in local activation treatment on dielectric alumina ceramics for selective electroless copper plating is developed. It is composed of silver or palladium salt activator and complex organic carrier and can be printed on the alumina substrate through printing method. After the local activation layer on alumina is formed in a sintering process at the temperature of 500℃, the selective electroless copper plating could be performed. A local copper coating, whose pattern is identical with printing graph, is obtained on alumina ceramics. The kinetics of the electroless copper plating and its dependence on different activation glue ink were investigated by monitoring the mixed potential of the specimen in plating bath using an electrochemical workstation. The morphology and composition of the activation layers and copper coatings on alumina were characterized by means of SEM and EDS. The proper concentration of silver and palladium salt in the glue ink is recommended as well. The results show that the surface of an alumina ceramic can be activated locally by using glue ink containing silver or palladium salts. This process is simple and cost⁃effective and can meet the needs of selective electroless copper deposition on alumina substrate, which shows good prospect in application.
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