首页> 中文期刊> 《机电工程技术》 >瓷砖抛光过程建模与仿真

瓷砖抛光过程建模与仿真

         

摘要

Many factors affect the polishing of ceramic tile. In the actual grinding process, it is easy to occur the phenomenon of without polishing in certain areas or polishing again. This paper mainly analyzes kinematics of polishing head in polisher and based on the model of grinding depth under certain pressure with different grain size,studies the influence of rotational speed of the abrasive disk,frequency of the lateral oscillation forward and speed of the polishing line on homogeneity of polishing surface, then combined with the grinding mechanism, using MATLAB software to simulate the polished ceramic process modeling. Finally, using multiple groups of different parameters to simulate,analyzed the effects of the uniformity in different conditions of polishing.%瓷砖的抛磨影响因素众多,实际磨削加工时容易出现漏抛、返抛现象。对陶瓷抛光机磨头进行运动学分析,并基于不同粒度号的磨粒在一定压力下的加工深度模型,探讨抛光机磨头转速、横梁摆动频率、传送速度对瓷砖抛光加工表面均匀性的影响,然后结合磨削机理使用MATLAB软件对陶瓷抛光过程进行仿真。最后使用多组不同的运动参数进行模拟试验,分析不同条件下抛光的均匀性影响。

著录项

相似文献

  • 中文文献
  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号