介绍了将经典抛光方法与数控加工技术有机结合的多模式组合抛光技术.描述了多模式组合抛光的关键技术之一,材料去除率仿真模型的建立方法.通过设置抛光盘因子和元件因子,多模式组合抛光的材料去除模型不仅包含抛光模式、速度等加工参数,还将抛光模形状、边角效应、元件面形误差等因素对材料去除的影响一并考虑入内,可以根据抛光阶段的不同,选择不同的仿真精度.实验发现,多模式组合抛光可以显著提高加工效率,并且具有较好的对中频误差的抑制和修正能力.多模式组合抛光目前的应用水平大致为球面、平面元件的面形误差达到20 nm(rms),非球面元件的面形误差达到30～40 nm(rms)左右.结果表明,多模式组合抛光在大口径元件的光学加工方面具有较强的适用性和很大的发展空间.%The multi-mode combined polishing technology based on traditional polishing and numerical control polishing methods was introduced. The simulation of material removal rate, one of the key processes of the multi-mode combined polishing, was described in detail. By setting the factors of laps and workpieces, the model for material removal rates involves not only polishing modes and polishining velocity but also the influences of the lap shape, edge effect and surface error on material removal rates. Furthermore,it can choose the different simulation precisions depending on the manufacture process. The practical results show that the multi-mode combined polishing technique provides high polishing efficiency and suppresses and reduces the ripple efficiently. The precision of surface error of optical spheres and flats can reach 20 nm (rms) and those fuyof the aspheres can be 30 nm to 40 nm (rms) so far. Obtained results indicate that the multi-mode combine polishing is a proper technology for the manufacture of large components.
展开▼
