试验采用阳极键合技术成功实现了硅片与玻璃管的键合,分析了玻璃管长度、温度及电极分别对电流和键合强度的影响.键合过程中电流随着温度升高而增大,但随着玻璃管长度的增加而减小.初始时电流都先迅速增大至峰值电流,然后随着时间的延长而逐渐减小.采用万能材料试验机对试样进行拉伸测试,结果显示键合强度随着玻璃管长度的增加而减小,而随着温度的升高而增大.同条件下,使用凹型电极的硅-玻璃管的强度比使用平行电极得到的强度要高,分析认为:玻璃管长度的增加导致外加电场强度减小和电阻增大,影响离子迁移及界面氧化反应,而凹型电极的使用对键合起到了促进作用.通过SEM扫描分析了硅-玻璃管的键合界面,结果表明键合界面良好.%The anodic bonding between silicon and glass tube has been achieved successfully and the effect of length of the glass tube,temperature and electrode on current and bonding strength was analyzed.During the bond-ing process, the current increases with the increase of the temperature, but decreases with the increase of the length of the glass tube.At first, the current increases rapidly to the peak current, and then decreases with the time.The tensile strength of the samples were tested by the universal material testing machine, which shows that the bonding strength increases with the increase of the temperature, but decreases with the increase of the length of the glass tube.And under the same conditions, the strength obtained by the concave electrode is higher than that obtained by the parallel electrode.The analysis shows that the increase of the length of the glass tube leads to the decrease of the applied electric field intensity and the increase of the resistance, which affects the migration of ions and the in-terface oxidation reaction, and the use of the concave electrode has played a catalytic role in bonding.The bonding interface of the silicon-glass tube was analyzed by SEM scanning and the result shows that it is good.
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