With the the miniaturization of components and electronic terminal product miniaturization and lightweight, PCB design and manufacturing introduced using a laser drilled to about 100 micron pore size blind hole processing technology ( HDI- High Density Interconnector ) applicable to mobile communications and PC terminal consumer electronic products. Blind hole plugging resin technology was applied in HDI blind hole processing process to ensure the reliability of a new technique of blind hole method. The bold design and scale of production was in PCB 's production in the field of play great impetus, effectively improve the HDI and order HDI product reliability and production capacity.%随着电子产品元器件的小型化及电子终端产品的小型化和轻量化，PCB设计和制造者们推出了一种使用激光钻孔方式来进行100μm左右孔径盲孔加工的新工艺（HDI）以适用于移动通讯及PC等终端消费电子产品。盲孔树脂塞孔的工艺是适用于HDI盲孔加工过程中保证盲孔可靠性的一种新技术方法。其大胆的设计构思和可规模化的生产在PCB的制作领域发挥了极大的推动力，有效的提高了HDI及多阶HDI产品可靠性和制作工艺能力。
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